EP4SGX230KF40C2G

The EP4SGX230KF40C2G is an Intel FPGA implementing the Stratix IV device family architecture. It provides a programmable logic fabric with a large number of logic elements, substantial embedded memory, and extensive I/O for high-bandwidth, system‑level integration.

Targeted at designs that require high logic density, on‑chip memory, and advanced I/O capability, this commercial‑grade device supports applications that leverage high‑speed transceivers, DSP resources and flexible clocking available in the Stratix IV family.

Key Features

• Logic Capacity — 228,000 logic elements, enabling complex programmable logic implementations and large FPGA designs.
• Embedded Memory — Approximately 17.5 Mbits of on‑chip RAM to support buffers, FIFOs and local data storage.
• I/O Density — 744 general I/O pins, providing broad connectivity for external interfaces and parallel buses.
• High‑Speed Transceiver and Interface Support — Stratix IV device family features listed in the handbook include high‑speed transceiver capabilities and support for a wide range of protocols for high aggregate data bandwidth.
• DSP and Clocking — Device family documentation references digital signal processing (DSP) blocks along with dedicated clock networks and PLLs for advanced timing and signal processing tasks.
• Power — Core supply voltage range specified at 870 mV to 930 mV for the device core domain.
• Package and Mounting — 1517‑FBGA (40×40) FCBGA package; surface‑mount mounting type for board‑level integration.
• Commercial Temperature Grade — Operating range from 0 °C to 85 °C suitable for commercial applications.
• Regulatory Status — RoHS compliant.

Typical Applications

• High‑Speed Networking and Communications — Use the device family’s high‑speed transceiver features and high aggregate data bandwidth to implement networking interfaces and protocol bridges.
• Signal Processing and Acceleration — Leverage DSP blocks and the large logic element count together with on‑chip memory for real‑time signal processing and hardware acceleration tasks.
• Video and Imaging Systems — Combine substantial embedded RAM and wide I/O to handle video frame buffering, interface conversion, and high‑throughput data paths.
• Complex Interface Bridging — High I/O count and flexible clocking make the device suitable for bridging between multiple external memory and peripheral interfaces.

Unique Advantages

• High Logic Density: 228,000 logic elements provide the capacity to implement large, feature‑rich designs on a single device, reducing board count.
• Significant On‑Chip Memory: Approximately 17.5 Mbits of embedded RAM enables local buffering and reduces external memory dependencies.
• Extensive Connectivity: 744 I/O pins accommodate multiple high‑pin‑count interfaces and parallel buses without extensive external multiplexing.
• Family‑Level High‑Speed Features: Stratix IV family documentation outlines high‑speed transceivers, advanced I/O, DSP blocks, and PLL/clock networks, enabling designs that require high bandwidth and precise timing.
• Board‑Level Integration: 1517‑FBGA (40×40) package and surface‑mount mounting simplify placement in compact, high‑density PCBs.
• Commercial‑Grade Reliability: Rated for 0 °C to 85 °C operation and RoHS compliant for broader market acceptance.

Why Choose EP4SGX230KF40C2G?

The EP4SGX230KF40C2G combines a high logic element count, substantial embedded memory, and a large I/O complement in a single FCBGA package. Coupled with Stratix IV family features such as high‑speed transceivers, DSP resources and dedicated clocking elements, the device is positioned for designs that demand dense logic, heavy on‑chip buffering and broad external connectivity.

This device suits engineering teams building complex communications, signal processing, imaging, and interface‑heavy systems who need scalable FPGA resources, established family documentation, and commercial‑grade operating parameters for deployment in mainstream electronic products.

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