EP4SGX230KF40C3

The EP4SGX230KF40C3 is a Stratix® IV GX Field Programmable Gate Array (FPGA) from Intel, supplied in a 1517-BBGA (FCBGA) package. It delivers high logic capacity and abundant I/O in a surface-mount FBG A footprint for commercial-temperature designs.

With 228,000 logic elements, approximately 16.75 Mbits of embedded RAM and 744 general-purpose I/O, this device targets applications that require dense programmable logic, significant on-chip memory and large I/O counts while operating from a low-voltage core rail (870 mV–930 mV).

Key Features

• Core Logic: 228,000 logic elements providing large-scale programmable logic resources for complex digital functions.
• Embedded Memory: Total on-chip RAM of 17,544,192 bits (approximately 16.75 Mbits) to support data buffering, local storage and intermediate processing.
• I/O Capacity: 744 I/O pins to accommodate wide parallel interfaces, multiple peripherals and high-pin-count system integration.
• Package & Mounting: 1517-BBGA (FCBGA) package, supplier device package listed as 1517-FBGA (40×40), designed for surface-mount assembly.
• Power: Core supply range specified at 870 mV to 930 mV to match system power-rail planning for low-voltage FPGA cores.
• Operating Range: Commercial-grade temperature rating from 0 °C to 85 °C for standard commercial applications.
• Regulatory: RoHS compliant, supporting lead-free and restricted-substance requirements.

Typical Applications

• High-density digital systems: Use the large logic element count to implement complex state machines, custom processing pipelines and multi-function digital subsystems.
• Memory‑centric designs: Leverage approximately 16.75 Mbits of on-chip RAM for buffering, lookup tables and intermediate data storage without immediate external memory dependence.
• High‑pin I/O interfaces: Employ 744 I/O pins to connect multiple high-speed interfaces, expanders and board-level peripherals in dense system designs.

Unique Advantages

• High logic density: 228,000 logic elements provide capacity for large-scale logic integration, enabling consolidation of multiple functions into a single FPGA device.
• Significant embedded memory: Approximately 16.75 Mbits of on-chip RAM reduces reliance on external memory for many buffering and storage tasks.
• Extensive I/O count: 744 I/O pins simplify board-level connectivity for complex, multi-interface systems and reduce the need for external I/O expansion.
• Compact FCBGA packaging: 1517-BBGA (1517-FBGA 40×40) surface-mount package supports dense board layouts while maintaining high pin count.
• Commercial temperature suitability: Rated for 0 °C to 85 °C, appropriate for standard commercial electronic products and environments.
• RoHS compliance: Conforms to restricted-substance requirements for environmentally conscious manufacturing and procurement.

Why Choose EP4SGX230KF40C3?

The EP4SGX230KF40C3 positions itself as a high-capacity, high-I/O Stratix® IV GX FPGA option for commercial designs that demand substantial programmable logic, on-chip memory and broad connectivity. Its low-voltage core range and FCBGA packaging make it suitable for dense board integration where minimizing external components and maximizing on-chip resources are priorities.

This device is suited for engineering teams building complex digital systems that require scalability in logic and memory resources while operating within commercial temperature limits. As an Intel Stratix® IV GX family device, it offers a known FPGA architecture for designs that need robust programmable logic and sizable I/O in a surface-mount ball-grid package.

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