EP4SGX230KF40C4

The EP4SGX230KF40C4 is a Stratix® IV GX Field Programmable Gate Array (FPGA) in a 1517-ball FCBGA package. It provides 228,000 logic elements and approximately 17.5 Mbits of embedded memory, making it suitable for designs that require high logic capacity and on-chip RAM.

With 744 user I/O pins and a low-voltage supply range of 870 mV to 930 mV, this commercial-grade, surface-mount FPGA targets applications that need dense logic integration and significant I/O connectivity within a compact BGA footprint.

Key Features

• Core Logic 228,000 logic elements deliver substantial programmable logic capacity for complex digital designs.
• Embedded Memory Approximately 17.5 Mbits of on-chip RAM to support large data buffering, state storage, and embedded processing functions.
• I/O Density 744 user I/O pins provide extensive external connectivity for multi-channel interfaces and parallel peripherals.
• Power Nominal core supply range of 870 mV to 930 mV, enabling low-voltage operation as specified for this device.
• Package & Mounting 1517-BBGA (1517-FBGA, 40×40) package in a surface-mount form factor for compact board-level integration.
• Operating Range & Grade Commercial grade device rated for operation from 0 °C to 85 °C.
• Environmental Compliance RoHS-compliant construction to meet common regulatory requirements for lead-free electronic products.

Typical Applications

• High-density digital systems — Use the large logic element count and embedded memory for complex logic implementations and on-chip data processing.
• Multi-channel I/O interfaces — 744 I/O pins support designs requiring extensive external connectivity or parallel data paths.
• FPGA-based system integration — Compact 1517-FBGA packaging and surface-mount mounting enable integration into space-constrained boards.

Unique Advantages

• High logic capacity: 228,000 logic elements support large-scale programmable logic designs without immediate migration to multiple devices.
• Substantial on-chip memory: Approximately 17.5 Mbits of embedded RAM reduces external memory dependency for many buffering and storage tasks.
• Extensive I/O connectivity: 744 user I/Os simplify interfacing to multi-channel peripherals and parallel buses.
• Low-voltage core operation: 870 mV–930 mV supply range supports low-voltage system architectures as specified for the device.
• Compact BGA package: 1517-FBGA (40×40) enables high-density board layouts while maintaining a surface-mount form factor.
• RoHS compliance: Meets lead-free regulatory requirements for contemporary electronic assemblies.

Why Choose EP4SGX230KF40C4?

The EP4SGX230KF40C4 combines substantial programmable logic, significant embedded memory, and a high I/O count in a compact 1517-FBGA surface-mount package. Its specification set positions it for designs that require dense logic integration, on-chip storage, and broad external connectivity within commercial temperature ranges.

This device is suitable for engineers and teams developing advanced FPGA-based systems who need a single-device solution with clear, verifiable specifications for logic capacity, memory, I/O, power, package, and environmental compliance.

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