EP4SGX230KF40C4NGB

The EP4SGX230KF40C4NGB is a Stratix IV GX Field Programmable Gate Array (FPGA) from Intel. It delivers a high logic element count and substantial on‑chip memory in a 1517‑FBGA (40×40) surface‑mount package, making it suitable for designs that require dense logic, extensive I/O, and embedded RAM.

Device documentation for the Stratix IV family highlights architecture features such as embedded memory, digital signal processing (DSP) blocks, clock networks, and high‑speed transceiver features. The device is supplied for commercial applications and is RoHS compliant.

Key Features

• Core Logic Approximately 228,000 logic elements (cells) for high‑density digital implementation.
• Embedded Memory Total on‑chip RAM of 17,544,192 bits (approximately 17.5 Mbits) to support large buffering and state storage without external memory.
• I/O Capacity 744 user I/O pins to connect multiple peripherals, buses, and interfaces directly to the FPGA fabric.
• Power Supply Specified core voltage range from 870 mV to 930 mV for the device core domain.
• Package & Mounting 1517‑BBGA (FCBGA) supplier device package (1517‑FBGA, 40×40) in a surface‑mount form factor for compact PCB integration.
• Operating Range & Grade Commercial grade operation with an operating temperature range of 0 °C to 85 °C.
• Standards Compliance RoHS compliant to support regulatory and environmental requirements.
• Family Documentation Stratix IV device handbook coverage includes architecture features, DSP blocks, clock networks, and high‑speed transceiver topics.

Typical Applications

• High‑density digital systems — Implement complex logic functions and protocol processing using the device’s large logic element count and on‑chip RAM.
• Signal processing and DSP — DSP block coverage in the Stratix IV handbook and substantial embedded memory support compute‑intensive, latency‑sensitive processing.
• High‑pin‑count interfacing — 744 I/Os enable multi‑lane bus implementations, peripheral aggregation, and complex board‑level I/O routing.
• Telecommunications and data aggregation — Family documentation includes high‑speed transceiver features suitable for designs requiring advanced I/O and transceiver considerations.

Unique Advantages

• High logic density: Approximately 228,000 logic elements provide the capacity to consolidate functions that would otherwise require multiple devices.
• Substantial on‑chip memory: Around 17.5 Mbits of embedded RAM reduces reliance on external memory for buffering and state storage.
• Extensive I/O resources: 744 I/O pins simplify integration with multiple external interfaces and parallel buses.
• Compact FCBGA package: 1517‑FBGA (40×40) surface‑mount packaging supports dense PCB layouts while maintaining required pin counts.
• Commercial‑grade suitability: Rated for 0 °C to 85 °C operation for standard commercial deployments.
• Regulatory compliance: RoHS compliant to meet common environmental standards.

Why Choose EP4SGX230KF40C4NGB?

The EP4SGX230KF40C4NGB positions itself as a high‑capacity Stratix IV GX FPGA option for commercial designs that need a large number of logic elements, significant embedded memory, and wide I/O capability in a compact FCBGA package. Its documented family features—including embedded memory, DSP blocks, clock networks, and high‑speed transceiver topics—make it appropriate for complex digital, signal processing, and multi‑interface applications.

Designed and manufactured by Intel, the device offers a combination of integration and documented architecture that supports scalability and long‑term design planning for engineering teams targeting dense, performance‑oriented FPGA implementations.

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