EP4SGX230KF40C4N

IC FPGA 744 I/O 1517FBGA
Part Description

Stratix® IV GX Field Programmable Gate Array (FPGA) IC 744 17544192 228000 1517-BBGA, FCBGA

Quantity 435 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1517-FBGA (40x40)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1517-BBGA, FCBGANumber of I/O744Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs9120Number of Logic Elements/Cells228000
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits17544192

Overview of EP4SGX230KF40C4N – Stratix® IV GX Field Programmable Gate Array (FPGA) IC

The EP4SGX230KF40C4N is a Stratix IV GX field programmable gate array (FPGA) IC manufactured by Intel. This commercial‑grade, surface‑mount device delivers large programmable logic capacity together with substantial embedded memory and a high I/O count for complex digital designs.

Designed for applications that require dense logic, on‑chip memory resources, and extensive I/O connectivity, the device combines 9,120 LABs with 228,000 logic elements, approximately 17.5 Mbits of embedded memory, and 744 I/O pins to support integration of multi‑function systems.

Key Features

  • Programmable logic capacity — 9,120 LABs providing 228,000 logic elements for large, fine‑grained digital designs.
  • Embedded memory — Approximately 17.5 Mbits of on‑chip RAM to support buffering, state machines, and memory‑intensive logic functions.
  • I/O density — 744 general‑purpose I/Os to support high pin‑count interfaces and multi‑lane connectivity.
  • Transceivers and DSP resources (device family) — The Stratix IV device handbook specifies transceiver performance and DSP block specifications for the family, enabling serial link and DSP‑oriented implementations as documented in the datasheet.
  • Configuration and debug — Configuration and JTAG specifications are provided in the Stratix IV device documentation for device programming and system debug.
  • Package and mounting — 1517‑BBGA (1517‑FBGA, 40×40) FCBGA package in a surface‑mount form factor for board‑level integration.
  • Power and thermal — Core supply range of 870 mV to 930 mV and an operating temperature range of 0 °C to 85 °C, suitable for commercial applications.
  • Compliance — RoHS compliant.

Typical Applications

  • High‑bandwidth communications — On‑device transceiver capabilities (documented in the Stratix IV handbook) and the large I/O count support multi‑lane serial links and protocol bridging.
  • DSP and signal processing — DSP block specifications included in the device family documentation enable implementation of compute‑intensive signal processing functions using the FPGA fabric and embedded memory.
  • Large logic integration and prototyping — 228,000 logic elements and 9,120 LABs accommodate complex control, processing, and glue logic in a single programmable device.
  • Memory‑centric designs — Approximately 17.5 Mbits of embedded RAM supports buffering, packet processing, and on‑chip data storage for system functions.

Unique Advantages

  • High-density programmable fabric: 228,000 logic elements provide the capacity to integrate multiple subsystems onto a single device, reducing external component count.
  • Substantial on‑chip memory: Approximately 17.5 Mbits of embedded RAM enables local data retention and high‑speed buffering without relying solely on external memory.
  • Extensive I/O availability: 744 I/Os support rich peripheral interfaces, parallel buses, and multi‑lane connectivity for complex system designs.
  • Package suitable for board integration: 1517‑BBGA (40×40 FCBGA) surface‑mount package facilitates compact, high‑density PCB layouts.
  • Datasheet-backed subsystem support: Detailed Stratix IV device handbook content—covering transceivers, PLLs, DSP blocks, memory block specifications, configuration, and DC/switching characteristics—supports informed design choices.
  • Commercial grade and RoHS compliant: Specifies an operating temperature range of 0 °C to 85 °C and RoHS compliance for standard commercial product deployments.

Why Choose EP4SGX230KF40C4N?

The EP4SGX230KF40C4N positions itself as a high‑capacity Stratix IV GX FPGA option for commercial designs that require dense logic, significant embedded memory, and wide I/O resources. Its combination of 228,000 logic elements, roughly 17.5 Mbits of RAM, and 744 I/Os makes it suitable for integrating multi‑function systems and implementing DSP or transceiver‑based subsystems as documented in the Stratix IV device handbook.

Backed by Intel’s Stratix IV device documentation, designers benefit from comprehensive electrical, configuration, and subsystem specifications to guide system integration, performance analysis, and manufacturing planning for commercial deployments.

Request a quote or submit an inquiry for pricing and availability to evaluate EP4SGX230KF40C4N for your next design.

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