EP4SGX230KF40C3N

The EP4SGX230KF40C3N is a Stratix IV GX FPGA packaged in a 1517-BBGA (1517-FBGA, 40×40) surface-mount package and manufactured by Intel. It provides a high-density programmable logic fabric with a large number of I/O pins and on-chip embedded memory for complex, I/O‑intensive designs.

Key device-level characteristics include 9,120 LABs (logic array blocks), 228,000 logic elements, approximately 17.5 Mbits of embedded memory, and 744 user I/O pins. The device operates at a core supply between 870 mV and 930 mV and is specified for commercial temperature operation from 0 °C to 85 °C. The device is RoHS compliant.

Key Features

• Core Logic Density  228,000 logic elements and 9,120 LABs (logic array blocks) provide extensive programmable logic for large designs.
• Embedded Memory  Approximately 17.5 Mbits of on-chip RAM to support buffering, packet processing, and state storage within the FPGA fabric.
• High I/O Count  744 user I/O pins enable connectivity to large peripheral sets, parallel interfaces, and multi-channel systems.
• Package & Mounting  1517-BBGA (supplier device package: 1517-FBGA, 40×40) in a surface-mount form factor for compact board integration.
• Power and Voltage  Core supply voltage specified from 870 mV to 930 mV to match system power rails and power budgeting requirements.
• Operating Temperature & Grade  Commercial grade device specified for 0 °C to 85 °C operation.
• Standards & Documentation  Device is part of the Stratix IV family; the Stratix IV device handbook documents device-level features such as transceiver performance, PLLs, DSP blocks, memory block specifications, and configuration/JTAG capabilities for Stratix IV devices.
• Environmental Compliance  RoHS compliant to support regulatory and manufacturing requirements.

Typical Applications

• High-density logic designs  Use the device where large amounts of programmable logic are needed to implement complex state machines, packet processing, or custom datapaths.
• I/O‑intensive systems  Leverage 744 I/O pins for designs that require many parallel interfaces, high channel counts, or extensive external connectivity.
• Embedded memory-dependent functions  Apply the approximately 17.5 Mbits of on-chip RAM for buffering, FIFOs, and on-chip storage in real‑time data handling applications.

Unique Advantages

• High logic capacity: 228,000 logic elements offer the scale to implement large, integrated FPGA designs without immediate upscaling.
• Substantial on-chip RAM: Approximately 17.5 Mbits of embedded memory reduces dependence on external memory for many buffering and storage tasks.
• Extensive I/O availability: 744 I/O pins simplify board-level routing for multi-channel and multi-interface systems, reducing the need for external multiplexing.
• Surface-mount BGA package: 1517-BBGA (40×40) enables a compact PCB footprint while supporting the device’s high pin count.
• Commercial operating range: Specified 0 °C to 85 °C operation and RoHS compliance for standard commercial deployments.
• Documented family features: The Stratix IV device handbook provides detailed device-level specifications (transceivers, PLLs, DSP blocks, memory blocks, configuration and JTAG) to support design validation and integration.

Why Choose EP4SGX230KF40C3N?

The EP4SGX230KF40C3N positions itself as a high-density Stratix IV GX FPGA option for commercial designs that require large programmable logic capacity, substantial on-chip memory, and a high number of I/O pins. Its package and supply voltage range support integration into compact, power-conscious PCBs while the device handbook resources provide detailed device-level specifications to aid integration and validation.

This device is suited to teams and projects that need scalable programmable logic with significant internal memory and connectivity, backed by Intel’s Stratix IV documentation for system-level design and verification.

If you would like pricing, availability, or to request a formal quote for EP4SGX230KF40C3N, please submit a quote request or contact the purchasing team with the part number and required quantity.