EP4SGX230KF40I4

The EP4SGX230KF40I4 is a Stratix® IV GX Field Programmable Gate Array (FPGA) IC from Intel, built for high-density programmable logic and advanced I/O integration. As a Stratix IV GX device, it targets designs requiring large logic capacity, significant on-chip memory, and high-speed transceiver features described in the device handbook.

Its combination of 228,000 logic elements, approximately 17.5 Mbits of embedded memory, and 744 I/O makes it suitable for high-bandwidth communications, complex signal processing, and demanding system-integration applications where industrial-grade temperature range and robust packaging are required.

Key Features

• High Logic Density  228,000 logic elements to implement complex digital functions and large-scale custom logic.
• Embedded Memory  Approximately 17.5 Mbits of on-chip RAM for buffering, packet processing, and local data storage.
• Extensive I/O  744 I/O pins to support wide external interfacing and parallel/serial connectivity.
• Stratix IV GX Architecture  Device family features include high-speed transceiver capabilities and an architecture optimized for high aggregate bandwidth (see Stratix IV device handbook).
• Power Supply  Core voltage range of 870 mV to 930 mV to match system power rails and power-management schemes.
• Industrial Temperature Grade  Rated for operation from −40°C to 100°C for reliable performance in industrial environments.
• Package & Mounting  1517-FBGA (40×40) FCBGA package, surface-mount mounting for compact, board-level integration.
• RoHS Compliant  Meets RoHS requirements for material compliance.

Typical Applications

• High-Speed Networking  Implements protocol processing, packet switching, and traffic management using the device’s high logic density and high-speed transceiver features.
• Data Center & Telecom Equipment  Handles bandwidth-intensive interfacing and external memory controller logic with abundant I/O and embedded RAM.
• Signal Processing & Acceleration  Supports DSP pipelines and custom hardware accelerators that require large on-chip memory and extensive logic resources.
• System Integration & Prototyping  Acts as a flexible system logic hub for mixed-signal boards and complex digital subsystems requiring many external interfaces.

Unique Advantages

• High integration density: 228,000 logic elements and substantial embedded memory reduce the need for external ASICs and discrete logic, simplifying PCB design.
• Large I/O count: 744 I/O pins provide flexibility for interfacing to parallel buses, multi-lane transceivers, and numerous peripherals.
• Industrial robustness: Rated −40°C to 100°C for deployment in industrial environments where extended temperature range is required.
• Compact packaging: 1517-FBGA (40×40) FCBGA enables a small board footprint while accommodating high pin count and thermal considerations.
• Power-compatible core: 870 mV–930 mV supply range facilitates integration with modern low-voltage power delivery systems.
• Standards-compliant manufacturing: RoHS compliance supports regulatory and environmental requirements for production.

Why Choose EP4SGX230KF40I4?

The EP4SGX230KF40I4 delivers a combination of large programmable logic resources, significant embedded memory, and extensive I/O in an industrial-temperature, RoHS-compliant FCBGA package. Its Stratix IV GX architecture and documented device handbook features make it suitable for designs that demand high aggregate data bandwidth and flexible protocol support.

This device is well suited to engineering teams building high-performance communications, signal-processing, and system-integration solutions that require scalability, on-board memory, and a reliable industrial temperature profile supported by Intel’s Stratix IV device documentation.

Request a quote or submit a purchase inquiry for EP4SGX230KF40I4 to check pricing and availability for your next high-density FPGA design.