EP4SGX230KF40I4N

The EP4SGX230KF40I4N is a Stratix® IV GX field programmable gate array (FPGA) device in a 1517-BBGA FCBGA package, offered in industrial grade. It provides high logic density and large on-chip memory suitable for designs that require substantial programmable logic, broad I/O capability and industrial temperature operation.

Key platform characteristics include 228,000 logic elements, approximately 17.5 Mbits of embedded memory, and 744 user I/Os, combined with a low-voltage core supply and a wide operating temperature range to support demanding embedded and industrial applications.

Key Features

• High Logic Density — 228,000 logic elements support complex, high-capacity designs and large-scale integration of custom logic functions.
• On‑Chip Memory — Approximately 17.5 Mbits of embedded RAM for buffering, lookup tables and state storage close to logic to reduce external memory dependence.
• Extensive I/O — 744 I/Os provide abundant interface options for multi-channel systems, wide buses and large peripheral connectivity.
• Package and Mounting — 1517-BBGA (1517-FBGA, 40×40) FCBGA package with surface-mount construction to support compact PCB layouts.
• Industrial Temperature Range — Rated for −40 °C to 100 °C operation, making it suitable for industrial environments and extended-temperature deployments.
• Low-Voltage Core — Core supply range of 870 mV to 930 mV to meet platform power architecture requirements.
• Standards and Documentation — Device handbook and datasheet content include comprehensive specifications for DC/switching characteristics, PLLs, transceivers, DSP block and TriMatrix memory block specifications to support detailed design and validation.
• RoHS Compliant — Conforms to RoHS requirements for environmental compliance.

Typical Applications

• Industrial Control & Automation — Industrial-grade temperature rating and extensive I/O make the device suitable for control systems, motor drives and factory automation interfaces.
• High-Density Logic Designs — Large logic element count supports complex state machines, protocol implementations and system consolidation on a single device.
• Memory-Intensive Processing — Approximately 17.5 Mbits of embedded RAM enables on-chip buffering, packet handling and data staging without relying solely on external memory.
• High‑I/O Interface Systems — Hundreds of I/Os are ideal for systems that require many peripheral connections, wide parallel buses or multi-lane signaling arrangements.

Unique Advantages

• High Integration Density: 228,000 logic elements reduce the need for multiple devices and simplify board-level integration.
• Large On‑Chip Memory: Approximately 17.5 Mbits of embedded RAM lowers external memory requirements and improves data-path latency.
• Robust Industrial Operation: −40 °C to 100 °C operating range supports deployment in harsh or temperature-variant environments.
• Comprehensive Design Reference: Detailed device handbook coverage (electrical characteristics, PLL, DSP, transceiver and memory block specifications) streamlines development and validation.
• Broad I/O Capacity: 744 I/Os give designers flexibility for rich peripheral sets and multi-channel interfaces.
• Compact Board Footprint: FCBGA 1517 package supports high-density PCBs while enabling surface-mount assembly.

Why Choose EP4SGX230KF40I4N?

The EP4SGX230KF40I4N positions itself as a high-density, industrial-grade Stratix IV GX FPGA combining substantial logic capacity, significant embedded memory and a large I/O count in a compact FCBGA package. These attributes make it well-suited to systems that demand integration of complex logic, on-chip data storage and broad peripheral connectivity within industrial temperature constraints.

Designers looking to consolidate functions, minimize external memory and implement multi-channel interfaces will find the device’s feature set and the supporting device handbook specifications valuable for system-level optimization and long-term design robustness.

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