EP4SGX290FF35C3G

The EP4SGX290FF35C3G is an Intel Stratix IV–family Field Programmable Gate Array supplied in a 1152‑FBGA (35×35) package. It provides high logic density and a large I/O complement for complex digital designs that require substantial on‑chip resources and interconnect.

Typical use cases include high‑bandwidth communications, programmable compute and signal processing applications, and system integration tasks where a combination of logic capacity, embedded memory and numerous I/O is required.

Key Features

• Core Logic  Approximately 291,200 logic elements to implement complex state machines, datapaths and custom processing logic.
• Embedded Memory  Approximately 17.66 Mbits of on‑chip RAM to support buffering, lookup tables and local storage for high‑performance designs.
• I/O Capacity  564 user I/O pins to support extensive peripheral, memory and protocol interfacing needs.
• Package & Mounting  1152‑BBGA (FCBGA) supplier device package (1152‑FBGA, 35×35) in a surface‑mount format for high‑density board designs.
• Power  Core voltage supply range of 0.870 V to 0.930 V for the FPGA core rail.
• Operating Range  Commercial operating temperature range of 0 °C to 85 °C for standard commercial applications.
• Standards & Compliance  RoHS‑compliant product status.
• Stratix IV Architecture  Part of the Stratix IV device family with documented device handbook content covering architecture, high‑speed transceivers, DSP blocks and I/O features.

Typical Applications

• High‑speed Communications & Networking  Aggregate data paths and protocol interfacing leveraging the Stratix IV architecture and large logic/memory resources.
• Digital Signal Processing  Implement DSP pipelines and custom accelerators using the large logic element count and substantial on‑chip RAM.
• Memory Interface & Bridging  Serve as programmable bridge or controller between multiple external interfaces using plentiful I/O and embedded memory.
• Custom Compute & Control  High‑density logic makes the device suitable for complex control systems, algorithm acceleration and integration of multiple functions on a single FPGA.

Unique Advantages

• High Logic Density:  Approximately 291,200 logic elements enable consolidation of large digital designs into a single device, reducing board complexity.
• Significant On‑Chip Memory:  Approximately 17.66 Mbits of embedded RAM supports large buffers, FIFOs and local data storage without relying solely on external memory.
• Extensive I/O Count:  564 I/O pins provide flexibility for broad peripheral connectivity and multi‑interface systems.
• Field‑Proven Architecture:  Built on the Stratix IV family architecture with documented features for transceivers, DSP blocks and clock networks in the device handbook.
• Compact, Surface‑Mount Packaging:  1152‑FBGA (35×35) package supports high‑density PCB layouts while maintaining a commercial assembly process.
• Regulatory Compliance:  RoHS compliance supports environmental and assembly requirements for mainstream electronic products.

Why Choose EP4SGX290FF35C3G?

The EP4SGX290FF35C3G is positioned for projects that require large programmable logic capacity, extensive embedded memory and a high I/O count within a single Stratix IV FPGA package. It is well suited for design teams targeting high‑performance digital processing, protocol aggregation and complex system integration at commercial operating conditions.

Engineers can rely on Intel’s Stratix IV device documentation for architecture and implementation guidance while leveraging the device’s on‑chip resources to reduce external component count and simplify board‑level design.

Request a quote or submit an inquiry to discuss availability, pricing and lead times for EP4SGX290FF35C3G.