EP4SGX230HF35I4N

The EP4SGX230HF35I4N is a Stratix® IV GX field programmable gate array (FPGA) manufactured by Intel. It delivers large on-chip logic capacity and embedded memory in a high-density FCBGA package for industrial-grade applications.

With 228,000 logic elements, approximately 17.54 Mbits of embedded RAM, and 564 general-purpose I/Os, this device is targeted at complex digital systems that require substantial integration, high I/O counts, and extended operating temperature support.

Key Features

• Core Logic Capacity  Provides 228,000 logic elements to implement large-scale digital designs and complex custom logic functions.
• Embedded Memory  Approximately 17.54 Mbits of on-chip RAM for buffering, state storage, and memory-intensive functions.
• I/O Density  564 available I/Os to support broad peripheral interfacing and multi-channel connectivity within a single device.
• Power and Core Voltage  Designed to operate with a core supply range of 0.87 V to 0.93 V, enabling defined power planning for system designers.
• Package and Mounting  1152‑FBGA (35 × 35) supplier package; surface-mount mounting minimizes board footprint while enabling high pin density.
• Operating Temperature and Grade  Industrial grade operation from −40 °C to 100 °C for reliable performance in demanding environments.
• Standards and Documentation  RoHS compliant; device-level documentation and the Stratix IV device handbook include DC/switching characteristics, transceiver and DSP block specifications, PLL and clock-tree details, and configuration/JTAG guidance.

Typical Applications

• Industrial Control Systems  High logic capacity and industrial temperature range make the device suitable for complex control, automation, and process-monitoring electronics.
• High‑Density Digital Systems  Large embedded RAM and abundant logic elements enable integration of complex state machines, protocol handling, and data path logic in a single FPGA.
• Multi‑I/O Platform Designs  The 564 I/Os support designs requiring many peripheral connections, sensor interfaces, and parallel I/O channels without multiple devices.

Unique Advantages

• High logic integration: 228,000 logic elements reduce the need for multiple FPGAs, simplifying board layout and lowering BOM complexity.
• Substantial on‑chip memory: Approximately 17.54 Mbits of embedded RAM supports local buffering and data processing without relying on external memory for many use cases.
• Extensive I/O capacity: 564 I/Os enable consolidation of multiple interfaces and sensors into one programmable device, improving system compactness.
• Industrial reliability: Rated for −40 °C to 100 °C operation and supplied in a dense FBGA package suitable for ruggedized systems.
• Comprehensive device documentation: The Stratix IV device handbook provides detailed electrical, timing, and peripheral block specifications to accelerate design and verification.
• RoHS compliant: Meets environmental compliance requirements for modern electronics manufacturing.

Why Choose EP4SGX230HF35I4N?

The EP4SGX230HF35I4N positions itself as a high-capacity FPGA option for engineers who need abundant logic resources, significant embedded memory, and a large I/O complement in an industrial-grade package. Its documented device-level specifications support predictable integration into complex systems.

This device is well suited to teams designing high-density digital subsystems that require on-chip memory for buffering and state handling, robust I/O routing, and operation across extended temperature ranges. The availability of detailed device documentation helps reduce integration risk and supports reliable system-level implementation.

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