EP4SGX230HF35I3

The EP4SGX230HF35I3 is a Stratix® IV GX Field Programmable Gate Array (FPGA) IC from Intel, supplied in a 1152‑BBGA FCBGA package. It provides a high logic capacity, substantial on‑chip memory, and a large number of I/O for designs that require dense programmable logic and extensive external interfacing.

With 228,000 logic elements, approximately 17.5 Mbits of embedded memory and 564 I/O pins, this industrial‑grade device targets applications that need significant integration, high I/O count and operation across a wide temperature range.

Key Features

• Logic Capacity 228,000 logic elements deliver a large programmable fabric for complex digital functions and custom logic implementations.
• Logic Blocks 9,120 logic blocks provide the structural resources for mapping designs across the FPGA fabric.
• Embedded Memory Approximately 17.5 Mbits of on‑chip RAM for buffering, lookup tables and local storage to support data‑intensive logic.
• I/O Density 564 I/O pins enable extensive external device interfacing and high‑pin‑count system integration.
• Power Supply Core voltage range of 870 mV to 930 mV for devices and designs that adhere to specified supply requirements.
• Package and Mounting 1152‑BBGA (supplier device package: 1152‑FBGA, 35×35) in a surface‑mount form factor suitable for compact board layouts.
• Industrial Temperature Range Rated for operation from −40 °C to 100 °C to support deployment in thermally demanding environments.
• RoHS Compliance RoHS‑compliant construction to meet environmental and manufacturing requirements.

Typical Applications

• High‑density logic systems — Implement custom processing pipelines and large sequential logic using the 228,000 logic elements and 9,120 logic blocks.
• Communications and networking equipment — Leverage 564 I/O pins and substantial on‑chip memory for protocol handling, packet buffering and high‑speed interfaces.
• Industrial control and automation — Industrial temperature rating (−40 °C to 100 °C) and robust packaging make it suitable for control systems and factory automation modules.

Unique Advantages

• High integration density: 228,000 logic elements and ~17.5 Mbits of embedded RAM reduce the need for external logic and memory, simplifying board-level designs.
• Extensive I/O capability: 564 I/O pins provide flexibility for connecting multiple peripherals, sensors, and high‑pin‑count interfaces.
• Industrial readiness: Specified operation from −40 °C to 100 °C supports deployment in harsh or temperature‑variable environments.
• Compact surface‑mount package: 1152‑BBGA (35×35) enables dense board layouts while maintaining high pin count for system integration.
• Environmentally compliant: RoHS compliance supports regulatory and manufacturing requirements for lead‑free assemblies.

Why Choose EP4SGX230HF35I3?

The EP4SGX230HF35I3 combines large programmable logic capacity, significant embedded memory and a high I/O count in an industrial‑rated package, delivering a balance of performance and integration for demanding designs. Its specifications make it well suited for engineers building complex digital systems, high‑density communications equipment, and industrial control platforms that require reliable operation across a wide temperature range.

Choosing this FPGA provides designers with the on‑chip resources to consolidate functionality, reduce external component count, and implement scalable architectures that address present and future system requirements.

Request a quote or submit an inquiry to receive pricing and availability information for EP4SGX230HF35I3.