EP4SGX230HF35C4N

IC FPGA 564 I/O 1152FBGA
Part Description

Stratix® IV GX Field Programmable Gate Array (FPGA) IC 564 17544192 228000 1152-BBGA, FCBGA

Quantity 598 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1152-FBGA (35x35)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1152-BBGA, FCBGANumber of I/O564Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs9120Number of Logic Elements/Cells228000
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits17544192

Overview of EP4SGX230HF35C4N – Stratix® IV GX Field Programmable Gate Array (FPGA)

The EP4SGX230HF35C4N is a Stratix IV GX family FPGA from Intel, delivering a large, reprogrammable logic fabric optimized for high-bandwidth system designs. It combines a substantial logic resource set with extensive on-chip memory and a high I/O count to support complex digital signal processing and high-speed interface requirements.

Built on the Stratix IV GX architecture, the device family provides features such as high-speed transceivers, DSP blocks, flexible clocking and external memory interface support—making this device suitable for communications, networking, video and compute-acceleration applications that require significant logic, memory and I/O integration.

Key Features

  • Logic Capacity — 228,000 logic elements for implementing large-scale custom logic, control and processing functions.
  • Embedded Memory — Approximately 17.5 Mbits of on-chip RAM to support buffering, frame storage and fast local memory access.
  • I/O Density — 564 general-purpose I/O pins to interface with peripherals, external memory and high-speed subsystems.
  • High-Speed Transceiver and PHY Features — Stratix IV GX device family includes high-speed transceiver capabilities and support for a wide range of protocols and aggregate data bandwidth as described in the device handbook.
  • DSP and Clocking Resources — Architecture-level support for digital signal processing blocks, multiple PLLs and flexible clock networks to implement deterministic, high-performance signal paths.
  • Power and Supply — Core voltage supply specified at 870 mV to 930 mV to match system power planning and regulator requirements.
  • Package and Mounting — 1152-ball FCBGA package (35 × 35 mm), surface-mount for compact system integration and thermal management.
  • Operating Range — Commercial temperature grade with an operating range of 0 °C to 85 °C.
  • Compliance — RoHS compliant for lead-free manufacturing processes.

Typical Applications

  • High-speed Networking & Telecom: Use the device's high-speed transceiver features and large logic fabric for packet processing, protocol bridging and line-rate interfaces.
  • Data Center & Acceleration: Leverage abundant logic elements and on-chip memory for custom accelerators, flow control and buffering in compute-intensive systems.
  • Video & Signal Processing: Implement real-time codecs, image pipelines and DSP-intensive algorithms using the device's DSP blocks and embedded RAM.
  • External Memory Interfaces: Support large buffering and system memory interfaces with the device family’s external memory interface features and high I/O count.

Unique Advantages

  • High Logic Integration: 228,000 logic elements enable consolidation of multiple functions into a single device, reducing board-level complexity.
  • Substantial On-Chip Memory: Approximately 17.5 Mbits of embedded RAM provide local storage for frames, FIFOs and scratch buffers without external memory dependence.
  • Extensive I/O for System Integration: 564 I/Os facilitate dense connectivity to peripherals, memories and high-speed PHYs.
  • Architecture Designed for High Bandwidth: Stratix IV GX family features—such as high-speed transceivers and flexible clocking—help implement high-throughput system designs.
  • Compact, Surface-Mount Package: The 1152-ball FCBGA (35 × 35 mm) package enables compact board layouts while supporting thermal and mechanical integration.
  • Commercial-Grade Availability: Specified operating range of 0 °C to 85 °C and RoHS compliance support mainstream commercial product development and manufacturing.

Why Choose EP4SGX230HF35C4N?

EP4SGX230HF35C4N positions itself as a high-capacity Stratix IV GX FPGA for engineers who need large logic resources, significant embedded memory and a high I/O count in a single, surface-mount package. Its architecture-level features—documented in the Stratix IV device handbook—provide the building blocks for high-bandwidth, DSP-heavy and interface-intensive designs.

This device is suited for system architects and design teams targeting communications, advanced signal processing and compute-acceleration applications where consolidation of functions, deterministic clocking and robust transceiver support are required. The combination of fabric capacity, memory and I/O makes it a practical choice for designs that require scalability and long-term device documentation and support within the Stratix IV family.

Request a quote or submit an inquiry to discuss availability, lead times and pricing for EP4SGX230HF35C4N. Our team can assist with technical specifications and procurement details to support your design cycle.

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