EP4SGX230HF35C4N
| Part Description |
Stratix® IV GX Field Programmable Gate Array (FPGA) IC 564 17544192 228000 1152-BBGA, FCBGA |
|---|---|
| Quantity | 598 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FBGA (35x35) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA, FCBGA | Number of I/O | 564 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 9120 | Number of Logic Elements/Cells | 228000 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 17544192 |
Overview of EP4SGX230HF35C4N – Stratix® IV GX Field Programmable Gate Array (FPGA)
The EP4SGX230HF35C4N is a Stratix IV GX family FPGA from Intel, delivering a large, reprogrammable logic fabric optimized for high-bandwidth system designs. It combines a substantial logic resource set with extensive on-chip memory and a high I/O count to support complex digital signal processing and high-speed interface requirements.
Built on the Stratix IV GX architecture, the device family provides features such as high-speed transceivers, DSP blocks, flexible clocking and external memory interface support—making this device suitable for communications, networking, video and compute-acceleration applications that require significant logic, memory and I/O integration.
Key Features
- Logic Capacity — 228,000 logic elements for implementing large-scale custom logic, control and processing functions.
- Embedded Memory — Approximately 17.5 Mbits of on-chip RAM to support buffering, frame storage and fast local memory access.
- I/O Density — 564 general-purpose I/O pins to interface with peripherals, external memory and high-speed subsystems.
- High-Speed Transceiver and PHY Features — Stratix IV GX device family includes high-speed transceiver capabilities and support for a wide range of protocols and aggregate data bandwidth as described in the device handbook.
- DSP and Clocking Resources — Architecture-level support for digital signal processing blocks, multiple PLLs and flexible clock networks to implement deterministic, high-performance signal paths.
- Power and Supply — Core voltage supply specified at 870 mV to 930 mV to match system power planning and regulator requirements.
- Package and Mounting — 1152-ball FCBGA package (35 × 35 mm), surface-mount for compact system integration and thermal management.
- Operating Range — Commercial temperature grade with an operating range of 0 °C to 85 °C.
- Compliance — RoHS compliant for lead-free manufacturing processes.
Typical Applications
- High-speed Networking & Telecom: Use the device's high-speed transceiver features and large logic fabric for packet processing, protocol bridging and line-rate interfaces.
- Data Center & Acceleration: Leverage abundant logic elements and on-chip memory for custom accelerators, flow control and buffering in compute-intensive systems.
- Video & Signal Processing: Implement real-time codecs, image pipelines and DSP-intensive algorithms using the device's DSP blocks and embedded RAM.
- External Memory Interfaces: Support large buffering and system memory interfaces with the device family’s external memory interface features and high I/O count.
Unique Advantages
- High Logic Integration: 228,000 logic elements enable consolidation of multiple functions into a single device, reducing board-level complexity.
- Substantial On-Chip Memory: Approximately 17.5 Mbits of embedded RAM provide local storage for frames, FIFOs and scratch buffers without external memory dependence.
- Extensive I/O for System Integration: 564 I/Os facilitate dense connectivity to peripherals, memories and high-speed PHYs.
- Architecture Designed for High Bandwidth: Stratix IV GX family features—such as high-speed transceivers and flexible clocking—help implement high-throughput system designs.
- Compact, Surface-Mount Package: The 1152-ball FCBGA (35 × 35 mm) package enables compact board layouts while supporting thermal and mechanical integration.
- Commercial-Grade Availability: Specified operating range of 0 °C to 85 °C and RoHS compliance support mainstream commercial product development and manufacturing.
Why Choose EP4SGX230HF35C4N?
EP4SGX230HF35C4N positions itself as a high-capacity Stratix IV GX FPGA for engineers who need large logic resources, significant embedded memory and a high I/O count in a single, surface-mount package. Its architecture-level features—documented in the Stratix IV device handbook—provide the building blocks for high-bandwidth, DSP-heavy and interface-intensive designs.
This device is suited for system architects and design teams targeting communications, advanced signal processing and compute-acceleration applications where consolidation of functions, deterministic clocking and robust transceiver support are required. The combination of fabric capacity, memory and I/O makes it a practical choice for designs that require scalability and long-term device documentation and support within the Stratix IV family.
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