EP4SGX230HF35C4

The EP4SGX230HF35C4 is a Stratix IV GX Field Programmable Gate Array (FPGA) offered in a 1152‑ball BGA FCBGA package. It delivers a high logic element count and substantial embedded memory, packaged for surface‑mount assembly and commercial‑temperature applications.

Designed for designs requiring large programmable fabric, dense I/O and on‑chip memory, the device is part of the Stratix IV GX device family and carries the device handbook documentation referenced for architecture and transceiver features.

Key Features

• Logic Capacity — 228,000 logic elements for complex programmable logic implementations and large-scale integration on a single device.
• Embedded Memory — Approximately 17.5 Mbits of on‑chip RAM to support buffering, frame memory, and intermediate storage without external memory in some use cases.
• I/O Density — 564 I/O pins to accommodate wide parallel busses, multiple interfaces, and system‑level connectivity.
• Stratix IV GX Architecture — Part of the Stratix IV GX family with documented high‑speed transceiver and protocol support features included in the device handbook.
• Package & Mounting — 1152‑ball BGA (FCBGA); supplier package listed as 1152‑FBGA (35×35). Surface‑mount mounting type for PCB assembly.
• Power — Core voltage supply range specified at 870 mV to 930 mV for core power planning and regulator selection.
• Commercial Temperature Range — Rated for 0 °C to 85 °C operation; device grade: Commercial.
• Regulatory Compliance — RoHS compliant.

Typical Applications

• Network and Communications Equipment — High logic capacity and dense I/O enable protocol engines, packet processing, and interfacing for communication systems.
• Data Center and Acceleration — Large programmable fabric and embedded memory support custom acceleration and offload functions where on‑chip resources reduce external memory dependency.
• Broadcast and Video Processing — Substantial on‑chip RAM and logic elements facilitate real‑time video pipelines and multi‑lane interfacing.
• Test & Measurement — High I/O count and flexible fabric enable multi‑channel acquisition, pre‑processing, and instrumentation control.

Unique Advantages

• High Logic and Memory Integration: 228,000 logic elements combined with ~17.5 Mbits of embedded RAM allow larger functions to be implemented on a single FPGA, reducing board complexity.
• Extensive I/O Capacity: 564 I/O pins provide system designers with the flexibility to connect multiple interfaces and peripherals without extensive external multiplexing.
• Stratix IV GX Family Features: Implements the architecture and documented transceiver capabilities of the Stratix IV GX series, useful where high‑speed protocol support is required.
• Compact FCBGA Packaging: The 1152‑ball BGA (35×35) package supports dense PCB layouts while maintaining a surface‑mount form factor for automated assembly.
• Commercial Readiness and Compliance: Commercial temperature rating and RoHS compliance simplify selection for commercial product lines.

Why Choose EP4SGX230HF35C4?

EP4SGX230HF35C4 positions itself as a high‑capacity Stratix IV GX FPGA option for commercial designs that need a large programmable fabric, substantial on‑chip memory, and a high I/O count in a compact BGA package. Its documented family features and device handbook provide guidance for leveraging transceiver and fabric capabilities in complex systems.

This device is well suited to engineering teams building networked equipment, data‑plane accelerators, video processing platforms, and high‑channel count instruments where integration density, on‑chip memory and I/O flexibility drive system architecture decisions.

Request a quote or submit a purchasing inquiry for EP4SGX230HF35C4 to check availability, lead times, and pricing for your next design.