EP4SGX230HF35C2N

The EP4SGX230HF35C2N is a Stratix® IV GX field‑programmable gate array (FPGA) from Intel, offered in a 1152‑FBGA (35×35) surface‑mount package. It presents a high‑density logic fabric with substantial on‑chip RAM and a large I/O count for designs that require extensive routing, memory, and interface resources.

Built on the Stratix IV GX device architecture described in the device handbook, this FPGA is suited to applications that leverage high logic capacity, abundant I/O, and on‑chip embedded memory, while operating within a commercial temperature range and a low core voltage supply.

Key Features

• High logic density — 228,000 logic elements to implement complex digital logic, control, and custom processing blocks.
• Embedded memory — Approximately 17.5 Mbits of on‑chip RAM to support FIFOs, buffers, and local data storage.
• Extensive I/O — 564 I/O pins enabling wide external interfacing and parallel connectivity options.
• Stratix IV GX architecture features — Architecture includes device core features such as DSP blocks, PLLs, clock networks, and high‑speed transceiver capabilities as described in the Stratix IV Device Handbook.
• Low‑voltage core — Core supply range of 870 mV to 930 mV to match low‑voltage system designs.
• Package and mounting — 1152‑BBGA (FCBGA) surface‑mount package (35×35) for compact board integration.
• Commercial grade operation — Rated for 0 °C to 85 °C operating temperature.
• RoHS compliant — Meets RoHS requirements for environmental compliance.

Typical Applications

• High‑speed communications — Leverage Stratix IV GX transceiver and I/O capabilities for protocol handling and interface bridging in communications equipment.
• Signal processing and DSP — Use on‑chip DSP resources and abundant logic elements for real‑time signal processing tasks.
• Memory interface and buffering — Integrate external memory interfaces with the FPGA’s embedded RAM for data buffering and high‑throughput storage controllers.
• Advanced embedded systems — Implement complex control, custom accelerators, and system integration functions that need high logic capacity and many I/O.

Unique Advantages

• High logic capacity: 228,000 logic elements enable large, multi‑function designs without external ASIC development.
• Substantial on‑chip RAM: Approximately 17.5 Mbits of embedded memory reduce dependence on external buffering and improve latency for local data paths.
• Large I/O footprint: 564 I/O pins support broad connectivity for parallel interfaces, sensors, and external peripherals.
• Low core voltage compatibility: 870–930 mV core supply accommodates low‑voltage system architectures.
• Compact FCBGA packaging: 1152‑FBGA (35×35) surface mount package provides a space‑efficient footprint for high‑density designs.
• Commercial temperature rating: Certified for 0 °C to 85 °C operation for standard commercial deployments.
• Standards‑aligned architecture: Stratix IV GX family features such as PLLs, clock networks, DSP blocks, and high‑speed transceivers provide a broad foundation for protocol and performance requirements.

Why Choose EP4SGX230HF35C2N?

EP4SGX230HF35C2N positions itself as a high‑density Stratix IV GX FPGA option from Intel for designers who need a combination of large logic resources, significant embedded memory, and a high I/O count in a compact FCBGA package. Its architecture supports integrations that rely on DSP resources, sophisticated clocking and transceiver features, and extensive external interfacing.

This device is appropriate for teams developing communications, signal processing, and advanced embedded systems where on‑chip memory, I/O capacity, and scalable logic resources are key selection criteria. The commercial temperature grade and RoHS compliance add predictability for standard production deployments.

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