EP4SGX230FF35I4N

The EP4SGX230FF35I4N is a Stratix® IV GX field programmable gate array (FPGA) from Intel, configured in a 1152-ball FCBGA package. It provides a large programmable fabric, substantial embedded memory, and a high I/O count for complex, I/O‑dense designs.

Designed for industrial applications, this device combines 228,000 logic elements with approximately 17.5 Mbits of on‑chip RAM and 564 user I/O pins, making it well suited to high‑integration functions that require wide temperature and supply tolerance.

Key Features

• Programmable Fabric — 228,000 logic elements for implementing large, complex logic networks and custom processing pipelines.
• Embedded Memory — Approximately 17.5 Mbits of on‑chip RAM to support buffering, lookup tables, and local data storage within the FPGA fabric.
• I/O Density — 564 user I/O pins to support high‑channel count interfaces and extensive peripheral connectivity.
• Transceiver and Core Capabilities (Device Handbook) — Includes transceiver and core performance specifications, PLLs, and DSP block details as documented in the Stratix IV device handbook.
• Power — Core voltage supply range specified from 870 mV to 930 mV, enabling operation within defined core power rails.
• Package and Mounting — 1152‑BBGA FCBGA (supplier package: 1152‑FBGA, 35 × 35) designed for surface‑mount assembly.
• Industrial Temperature Grade — Rated for operation from −40 °C to 100 °C for deployment in temperature‑challenging environments.
• Compliance — RoHS compliant for environmental and manufacturing compatibility.

Typical Applications

• Industrial Control Systems — Implement complex control logic, sensor aggregation, and real‑time decisioning where wide operating temperatures and high I/O counts are required.
• High‑Density I/O Switching — Consolidate multiple interfaces and I/O channels into a single device using the FPGA’s 564 I/O pins and large logic fabric.
• Signal Processing and DSP — Leverage on‑chip memory and documented DSP block specifications for data buffering and deterministic processing pipelines.
• Communications and Transceiver‑Based Designs — Use transceiver and datapath capabilities described in the Stratix IV device handbook for protocol and link implementations.

Unique Advantages

• Large Programmable Capacity: 228,000 logic elements enable implementation of sizable custom logic, reducing the need for multiple devices.
• Substantial Embedded Memory: Approximately 17.5 Mbits of on‑chip RAM supports local buffering and state storage to simplify external memory requirements.
• Very High I/O Count: 564 user I/Os provide flexibility to connect numerous peripherals, sensors, and high‑channel interfaces directly to the FPGA.
• Industrial‑Grade Thermal Range: Specified operation from −40 °C to 100 °C for deployment in robust environments where temperature resilience matters.
• Compact FCBGA Packaging: 1152‑BBGA (35 × 35) package balances high pin count with a space‑efficient footprint for surface‑mount PCB designs.
• Standards and Compliance: RoHS compliance facilitates integration into modern manufacturing and environmental workflows.

Why Choose EP4SGX230FF35I4N?

The EP4SGX230FF35I4N positions itself for designs that require a large programmable fabric, abundant on‑chip memory, and a high density of I/O in an industrial‑grade FPGA. Its documented core, transceiver, PLL, and DSP block specifications in the Stratix IV device handbook provide the technical detail needed for system integration and performance planning.

This device is suitable for engineering teams building complex industrial control, communications, and signal processing systems that demand scalable logic resources, substantial embedded memory, and reliable operation across a broad temperature range. Backed by Intel’s Stratix IV device documentation, the EP4SGX230FF35I4N supports long‑term deployment and maintainability within product lifecycles.

Request a quote or submit an inquiry to receive pricing and availability for the EP4SGX230FF35I4N and to discuss how it can fit into your next design.