EP4SGX230FF35I3N

IC FPGA 564 I/O 1152FBGA
Part Description

Stratix® IV GX Field Programmable Gate Array (FPGA) IC 564 17544192 228000 1152-BBGA, FCBGA

Quantity 810 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1152-FBGA (35x35)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1152-BBGA, FCBGANumber of I/O564Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs9120Number of Logic Elements/Cells228000
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits17544192

Overview of EP4SGX230FF35I3N – Stratix® IV GX Field Programmable Gate Array (FPGA) IC

The EP4SGX230FF35I3N is an Intel Stratix IV GX FPGA in a 1152-BBGA (35×35) FCBGA package designed for high-density, high-performance digital logic integration. It provides substantial on-chip resources including 228,000 logic elements, approximately 17.5 Mbits of embedded memory, and 564 I/O pins to support complex system designs.

Targeted at industrial applications, the device combines broad I/O, embedded memory, and architecture-level features documented in the Stratix IV device handbook (transceivers, DSP resources, PLLs, TriMatrix memory) to support demanding signal-processing and high-speed interfacing tasks within an operating range of –40°C to 100°C.

Key Features

  • Core Logic – 228,000 logic elements for implementing complex digital functions and large-scale programmable logic designs.
  • Embedded Memory – Approximately 17.5 Mbits of on-chip RAM to support buffering, look-up tables, and local data storage without external memory.
  • I/O Density – 564 I/O pins to accommodate extensive external connectivity and multiple parallel interfaces.
  • High‑Level Architecture Blocks – Device handbook coverage includes transceiver performance, DSP blocks, TriMatrix memory blocks, PLLs, and clock tree specifications for system-level planning.
  • Power and Supply – Core voltage supply range specified between 870 mV and 930 mV for power planning and system integration.
  • Package and Mounting – 1152-BBGA (1152-FBGA, 35×35) FCBGA, surface-mount package suitable for compact, board-level deployments.
  • Industrial Temperature Range – Rated for operation from –40°C to 100°C for use in industrial environments.
  • Standards Compliance – RoHS-compliant construction for regulatory and supply-chain compatibility.

Typical Applications

  • High‑Performance Signal Processing – Large logic capacity and on-chip memory make the FPGA well suited for DSP algorithms, real-time processing, and data aggregation tasks.
  • High‑Speed Interface and Networking – Abundant I/O and documented transceiver performance support multi-channel interfaces and high-throughput communications systems.
  • Industrial Control and Automation – Industrial-grade temperature range and dense I/O allow deployment in control systems, motion control, and sensor aggregation applications.
  • System Integration and Prototyping – The device’s combination of logic, memory, and architecture-level blocks supports integration of control, protocol bridging, and custom hardware accelerators.

Unique Advantages

  • High Logic Capacity: 228,000 logic elements enable complex designs and extensive parallelism without partitioning across multiple devices.
  • Substantial On‑Chip Memory: Approximately 17.5 Mbits of embedded RAM reduces dependence on external memory and simplifies board-level BOM.
  • Extensive I/O Count: 564 I/Os provide flexibility for interfacing with multiple peripherals, mezzanine cards, and high-channel-count systems.
  • Comprehensive Architecture Documentation: The Stratix IV device handbook includes detailed specifications for transceivers, DSP blocks, PLLs, and clocking, aiding system design and verification.
  • Industrial‑Grade Thermal Range: Operation from –40°C to 100°C supports deployment in harsher environments and extended-temperature applications.
  • Surface‑Mount, High‑Density Package: 1152-BBGA FCBGA package enables compact PCB layouts while delivering high I/O and signal density.

Why Choose EP4SGX230FF35I3N?

The EP4SGX230FF35I3N positions itself as a high-density Stratix IV GX FPGA option that balances large logic capacity, significant embedded memory, and broad I/O connectivity in a single industrial‑grade package. Its documented architecture-level features—transceivers, DSP resources, TriMatrix memory, PLLs, and clocking—support system designs that require integrated processing, high-speed data paths, and flexible interfacing.

This device is well suited for engineers and system integrators building industrial, communications, and advanced signal-processing applications who need verified architectural details, compact packaging, and a robust operating temperature range for reliable, long-term deployment.

Request a quote or submit an inquiry to receive pricing, availability, and support information for EP4SGX230FF35I3N.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1968


    Headquarters: Santa Clara, California, USA


    Employees: 130,000+


    Revenue: $54.23 Billion


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018


    Featured Products
    Latest News
    keyboard_arrow_up