EP4SGX230FF35I3N
| Part Description |
Stratix® IV GX Field Programmable Gate Array (FPGA) IC 564 17544192 228000 1152-BBGA, FCBGA |
|---|---|
| Quantity | 810 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FBGA (35x35) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA, FCBGA | Number of I/O | 564 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 9120 | Number of Logic Elements/Cells | 228000 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 17544192 |
Overview of EP4SGX230FF35I3N – Stratix® IV GX Field Programmable Gate Array (FPGA) IC
The EP4SGX230FF35I3N is an Intel Stratix IV GX FPGA in a 1152-BBGA (35×35) FCBGA package designed for high-density, high-performance digital logic integration. It provides substantial on-chip resources including 228,000 logic elements, approximately 17.5 Mbits of embedded memory, and 564 I/O pins to support complex system designs.
Targeted at industrial applications, the device combines broad I/O, embedded memory, and architecture-level features documented in the Stratix IV device handbook (transceivers, DSP resources, PLLs, TriMatrix memory) to support demanding signal-processing and high-speed interfacing tasks within an operating range of –40°C to 100°C.
Key Features
- Core Logic – 228,000 logic elements for implementing complex digital functions and large-scale programmable logic designs.
- Embedded Memory – Approximately 17.5 Mbits of on-chip RAM to support buffering, look-up tables, and local data storage without external memory.
- I/O Density – 564 I/O pins to accommodate extensive external connectivity and multiple parallel interfaces.
- High‑Level Architecture Blocks – Device handbook coverage includes transceiver performance, DSP blocks, TriMatrix memory blocks, PLLs, and clock tree specifications for system-level planning.
- Power and Supply – Core voltage supply range specified between 870 mV and 930 mV for power planning and system integration.
- Package and Mounting – 1152-BBGA (1152-FBGA, 35×35) FCBGA, surface-mount package suitable for compact, board-level deployments.
- Industrial Temperature Range – Rated for operation from –40°C to 100°C for use in industrial environments.
- Standards Compliance – RoHS-compliant construction for regulatory and supply-chain compatibility.
Typical Applications
- High‑Performance Signal Processing – Large logic capacity and on-chip memory make the FPGA well suited for DSP algorithms, real-time processing, and data aggregation tasks.
- High‑Speed Interface and Networking – Abundant I/O and documented transceiver performance support multi-channel interfaces and high-throughput communications systems.
- Industrial Control and Automation – Industrial-grade temperature range and dense I/O allow deployment in control systems, motion control, and sensor aggregation applications.
- System Integration and Prototyping – The device’s combination of logic, memory, and architecture-level blocks supports integration of control, protocol bridging, and custom hardware accelerators.
Unique Advantages
- High Logic Capacity: 228,000 logic elements enable complex designs and extensive parallelism without partitioning across multiple devices.
- Substantial On‑Chip Memory: Approximately 17.5 Mbits of embedded RAM reduces dependence on external memory and simplifies board-level BOM.
- Extensive I/O Count: 564 I/Os provide flexibility for interfacing with multiple peripherals, mezzanine cards, and high-channel-count systems.
- Comprehensive Architecture Documentation: The Stratix IV device handbook includes detailed specifications for transceivers, DSP blocks, PLLs, and clocking, aiding system design and verification.
- Industrial‑Grade Thermal Range: Operation from –40°C to 100°C supports deployment in harsher environments and extended-temperature applications.
- Surface‑Mount, High‑Density Package: 1152-BBGA FCBGA package enables compact PCB layouts while delivering high I/O and signal density.
Why Choose EP4SGX230FF35I3N?
The EP4SGX230FF35I3N positions itself as a high-density Stratix IV GX FPGA option that balances large logic capacity, significant embedded memory, and broad I/O connectivity in a single industrial‑grade package. Its documented architecture-level features—transceivers, DSP resources, TriMatrix memory, PLLs, and clocking—support system designs that require integrated processing, high-speed data paths, and flexible interfacing.
This device is well suited for engineers and system integrators building industrial, communications, and advanced signal-processing applications who need verified architectural details, compact packaging, and a robust operating temperature range for reliable, long-term deployment.
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