EP4SGX230FF35I3

The EP4SGX230FF35I3 is a Stratix IV GX field programmable gate array packaged in a 1152-BBGA (1152-FBGA, 35×35) FCBGA package for surface-mount PCB assembly. The device provides approximately 228,000 logic elements, approximately 17.5 Mbits of embedded memory, and 564 I/O pins, targeted at complex, high-density FPGA implementations.

Engineered for industrial applications, the device supports a core supply range of 870 mV to 930 mV and an operating temperature range of −40 °C to 100 °C. Detailed device-level specifications—including transceiver, PLL, DSP block, memory block and configuration information—are documented in the Stratix IV device handbook.

Key Features

• Core density  Approximately 228,000 logic elements to implement large-scale logic, control and datapath functions.
• Embedded memory  Approximately 17.5 Mbits of on-chip RAM, useful for buffering, lookup tables and packet memory.
• I/O and interfaces  564 user I/O pins to support wide parallel interfaces and flexible board-level connectivity; device handbook includes transceiver performance and datapath sections.
• Programmable DSP and clocking  Device documentation includes DSP block specifications, PLL specifications and clock tree details to support synthesized digital signal processing and timing architectures.
• Power  Core supply range specified from 870 mV to 930 mV; power consumption guidance is provided in the device handbook.
• Package and thermal  1152-BBGA (1152-FBGA, 35×35) FCBGA surface-mount package; industrial operating temperature −40 °C to 100 °C.
• Configuration and system features  Device handbook provides configuration and JTAG specifications, temperature sensing diode details, and chip-wide reset (Dev_CLRn) information.
• Regulatory  RoHS compliant.

Typical Applications

• High-performance communications equipment  Large logic capacity and documented transceiver datapath support protocol processing and high-throughput datapaths.
• Signal processing and DSP systems  On-chip DSP block specifications and substantial embedded memory enable implementation of filtering, transforms and real-time processing functions.
• Industrial control and automation  Industrial-grade temperature range (−40 °C to 100 °C) and plentiful I/O make the device suitable for ruggedized control, motor drives and sensor aggregation.
• High-density system integration  High logic element count and a large I/O complement allow consolidation of complex subsystems onto a single FPGA to reduce board-level component count.

Unique Advantages

• High logic capacity: Approximately 228,000 logic elements enable complex SoC-style designs and extensive custom logic integration.
• Substantial embedded memory: Approximately 17.5 Mbits of RAM reduce reliance on external memory for buffering and local data storage.
• Large I/O complement: 564 I/Os provide flexibility for parallel interfaces, multi-lane connectivity and board-level partitioning.
• Industrial temperature rating: −40 °C to 100 °C supports deployment in demanding environmental conditions.
• Compact, high-density package: 1152-BBGA / 1152-FBGA (35×35) FCBGA enables dense PCB routing and compact system layouts.
• Comprehensive device documentation: The Stratix IV device handbook includes detailed electrical characteristics, timing, transceiver, PLL, DSP and configuration guidance to support design validation and implementation.

Why Choose EP4SGX230FF35I3?

The EP4SGX230FF35I3 combines high logic element density, significant on-chip memory and a large I/O count in a surface-mount FCBGA package rated for industrial temperatures. These attributes make it well suited for designers who need to integrate complex control, datapath and interface logic on a single FPGA while maintaining rugged environmental capability.

Supported by the Stratix IV device handbook with detailed specifications for transceivers, DSP blocks, clocking and configuration, the EP4SGX230FF35I3 is appropriate for systems where integration, determinism and board-level density are priorities.

Request a quote or submit an inquiry for pricing and availability of EP4SGX230FF35I3 to begin sourcing and integration planning.