EP4SGX230FF35C3NES

The EP4SGX230FF35C3NES is a Stratix IV GX field programmable gate array (FPGA) from Intel (Altera) designed for high‑capacity, high‑I/O designs. It combines a large logic fabric with embedded memory and on‑device transceiver and DSP capabilities described in the Stratix IV device handbook.

With 228,000 logic elements, approximately 17.5 Mbits of embedded RAM and 564 I/O pins in a 1152‑FBGA (35×35) surface‑mount package, this device targets applications that require significant logic density, extensive I/O connectivity and integrated fabric-level features such as PLLs, clock networks and high‑speed transceivers.

Key Features

• Core Capacity  228,000 logic elements provide fabric resources for complex logic, control and datapath implementations.
• Embedded Memory  Approximately 17.5 Mbits of on‑chip RAM to support buffer, FIFO and local storage requirements.
• I/O Density  564 device I/O pins accommodate wide external interfaces and dense board routing.
• Stratix IV GX Family Features  Includes Stratix IV device handbook features such as high‑speed transceivers, DSP blocks, PLLs and extensive clock networks for synchronous system design.
• Package & Mounting  1152‑FBGA (35×35) surface‑mount package (also denoted 1152‑BBGA, FCBGA) for compact, high‑pin‑count board integration.
• Power Supply  Core supply voltage range of 0.870 V to 0.930 V to match board power budgets and regulator designs.
• Operating Range  Commercial grade operation from 0 °C to 85 °C for standard commercial environments.
• Diagnostics & Signal Integrity  Device handbook coverage includes diagnostic features and signal‑integrity considerations for robust high‑speed designs.

Typical Applications

• High‑speed communications and networking  On‑device transceivers and a high aggregate I/O count support protocol implementations and high‑throughput interfaces.
• DSP and signal processing  Large logic fabric and embedded RAM enable implementation of DSP pipelines and accelerators using the device’s DSP resources.
• External memory interface controllers  Generous I/O and embedded memory make the device suitable for designs that bridge to high‑speed external memory.
• Video and imaging systems  High logic density and on‑chip RAM support buffering, image processing and real‑time dataflow requirements.

Unique Advantages

• High logic density: 228,000 logic elements allow consolidation of multiple functions into a single FPGA fabric.
• Substantial embedded memory: Approximately 17.5 Mbits of on‑chip RAM reduces dependence on external memory for many intermediate storage needs.
• Extensive I/O: 564 I/O pins support wide parallel buses, multiple interfaces and flexible board partitioning.
• Integrated system features: On‑device PLLs, clock networks, DSP blocks and high‑speed transceiver functionality (as described in the Stratix IV device handbook) simplify system integration.
• Compact, high‑pin package: 1152‑FBGA (35×35) packaging provides high connectivity in a compact footprint for space‑constrained PCBs.
• Commercial temperature rating: 0 °C to 85 °C operation fits standard commercial product deployments and test environments.

Why Choose EP4SGX230FF35C3NES?

The EP4SGX230FF35C3NES positions itself as a high‑capacity Stratix IV GX FPGA that combines large logic resources, significant embedded memory and a high I/O count in a compact 1152‑FBGA package. Its documented family features—high‑speed transceivers, DSP blocks, PLLs and extensive clocking—make it suitable for designs that demand integrated datapath processing and dense external interfacing.

This device is appropriate for engineering teams building demanding communication, DSP, video or memory‑interface subsystems who require a proven Stratix IV GX device from Intel (Altera) with clear, verifiable specifications for power, temperature and package integration.

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