EP4SGX230FF35C2XN

The EP4SGX230FF35C2XN is a Stratix IV GX family FPGA manufactured by Intel, supplied in a 1152-BBGA (35×35) FCBGA package for surface-mount assembly. It delivers a high logic capacity FPGA fabric with substantial on-chip RAM and a large I/O count for designs that require dense logic, memory, and interface integration.

Targeted at commercial-temperature applications, this device combines the Stratix IV GX device family features documented in the Stratix IV Device Handbook—including high-speed transceiver capability, DSP resources, PLLs, and extensive clock networks—with a focus on high-bandwidth system integration and protocol support.

Key Features

• Logic Capacity — 228,000 logic elements (cells) to implement complex digital logic and system-on-chip functions.
• Embedded Memory — Approximately 17.5 Mbits of on-chip RAM for buffering, FIFOs, and local data storage.
• High I/O Count — 564 I/O pins to support wide parallel interfaces and multiple external peripherals.
• Stratix IV GX Family Features — Includes Stratix IV GX device characteristics such as high-speed transceivers, DSP blocks, PLLs, and extensive clock networks as described in the Stratix IV Device Handbook.
• Package & Mounting — 1152-BBGA (supplier package: 1152-FBGA, 35×35) in a surface-mount form factor suitable for compact, high-density PCB designs.
• Power — Core supply range specified from 870 mV to 930 mV to match system power-rail planning and regulator selection.
• Commercial Temperature Grade — Operating temperature range 0 °C to 85 °C for commercial applications; RoHS compliant.

Typical Applications

• High-performance communications and networking — Used where large logic counts, high I/O density, and the Stratix IV GX transceiver and protocol support are needed for packet processing, switching, and aggregation.
• Signal processing and DSP acceleration — Leverages on-chip memory and the family’s DSP resources to implement real-time filtering, encoding, or other compute-intensive signal-processing blocks.
• High-bandwidth memory interfaces — Suitable for designs requiring significant on-chip buffering and external memory interfacing supported by the device family’s external memory interface features.
• System integration and prototyping — Provides a high logic and I/O count in a compact BGA package for integrating multiple subsystems onto a single FPGA fabric during development and deployment.

Unique Advantages

• High logic density: 228,000 logic elements enable consolidation of multiple functions and complex state machines in a single device, reducing board-level complexity.
• Substantial embedded memory: Approximately 17.5 Mbits of on-chip RAM supports large buffering, deep FIFOs, and local data storage to reduce external memory bandwidth pressure.
• Extensive I/O resources: 564 I/Os allow flexible routing of parallel interfaces, multiple peripherals, and broad external connectivity without additional multiplexing logic.
• Family-level high-speed features: Stratix IV GX device characteristics—documented transceivers, DSP blocks, PLLs, and clock networks—provide a platform for high-bandwidth, protocol-rich designs.
• Compact surface-mount package: 1152-BBGA (35×35) provides a high-pin-count solution in a footprint optimized for dense PCB layouts.
• Commercial-grade readiness: Specified operating range of 0 °C to 85 °C with RoHS compliance for standard commercial deployments.

Why Choose EP4SGX230FF35C2XN?

The EP4SGX230FF35C2XN positions itself as a high-capacity Stratix IV GX FPGA intended for commercial applications that require a combination of large logic resources, significant embedded memory, and extensive I/O. Its family-level features—such as high-speed transceivers, DSP capabilities, and robust clocking and PLL options—support high-bandwidth and protocol-diverse system designs.

Designed to simplify integration of complex functions onto a single device, this FPGA is suited to engineers and teams building network equipment, high-speed data systems, and signal-processing platforms who need deterministic device specifications, commercial-temperature operation, and a high-density BGA package for compact PCBs.

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