EP4SGX230FF35C3G

The EP4SGX230FF35C3G is an Intel Stratix IV family Field Programmable Gate Array (FPGA) device offered in a 1152‑FBGA surface‑mount package. It combines high logic density and embedded memory with Stratix IV architecture features referenced in the device handbook.

This device targets designs that require large programmable logic capacity, substantial on‑chip RAM, extensive I/O, and the Stratix IV family’s on‑chip resources such as DSP blocks, PLLs and high‑speed transceiver features for high aggregate data bandwidth and protocol flexibility.

Key Features

• Logic Capacity  Approximately 228,000 logic elements to implement complex, high‑integration digital designs.
• Embedded Memory  Approximately 17.5 Mbits of on‑chip RAM (Total Ram Bits: 17,544,192) for buffering, FIFOs and on‑chip data storage.
• I/O Density  564 programmable I/O pins to support wide external connectivity and multi‑channel interfaces.
• Stratix IV Architecture Features  Device handbook references include DSP blocks, clock networks, PLLs, and FPGA fabric features that support high‑performance signal processing and system integration.
• High‑Speed Transceiver Support  Datasheet series content references high‑speed transceiver features and support for high aggregate data bandwidth and a wide range of protocols.
• Package & Mounting  1152‑FBGA (35×35) / 1152‑BBGA FCBGA supplier package in a surface‑mount form factor suitable for standard PCB assembly.
• Power  Core voltage supply specified between 870 mV and 930 mV.
• Commercial Grade & Environmental  Commercial grade device rated for 0 °C to 85 °C operating temperature and RoHS compliant.

Typical Applications

• High‑Bandwidth Communications  Use in networking and telecommunications equipment where Stratix IV transceiver features and high aggregate data bandwidth are required.
• Signal Processing & Acceleration  Implement DSP pipelines and custom accelerators leveraging on‑chip DSP blocks and large embedded memory.
• Video and Imaging Systems  Buffering and real‑time data manipulation using the device’s abundant logic elements and on‑chip RAM.
• Test & Measurement  High I/O count and flexible fabric allow custom measurement front‑ends and data capture solutions.

Unique Advantages

• High Logic Density: ~228,000 logic elements enable integration of complex control, protocol and processing functions into a single device.
• Substantial On‑chip Memory: Approximately 17.5 Mbits of embedded RAM reduce external memory dependence and simplify board design.
• Extensive I/O Count: 564 I/Os provide flexibility for multi‑lane interfaces, parallel buses and mixed signal I/O architectures.
• Stratix IV Family Resources: Architecture features documented in the device handbook—DSP blocks, PLLs, clock networks and high‑speed I/O—support demanding signal processing and timing architectures.
• Commercial‑Grade, RoHS Compliant: Commercial temperature range (0 °C to 85 °C) and RoHS compliance simplify regulatory and assembly considerations for volume applications.
• Compact FBGA Package: 1152‑FBGA (35×35) surface‑mount package balances pin count and board area for space‑constrained designs.

Why Choose EP4SGX230FF35C3G?

The EP4SGX230FF35C3G provides a combination of high logic capacity, significant embedded memory, and extensive I/O in a Stratix IV family FPGA package. It is suited for designs that need substantial on‑chip resources—such as high‑throughput communications, real‑time signal processing, and complex system integration—while remaining within commercial temperature and RoHS requirements.

Choosing this device gives designers access to the documented Stratix IV architecture features (DSP blocks, PLLs, clock networks, and high‑speed transceiver capabilities) and a high‑pin‑count FBGA package, enabling consolidation of multiple functions and streamlined board-level design.

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