EP4SGX230FF35C2X
| Part Description |
Stratix® IV GX Field Programmable Gate Array (FPGA) IC 564 17544192 228000 1152-BBGA, FCBGA |
|---|---|
| Quantity | 556 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FBGA (35x35) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA, FCBGA | Number of I/O | 564 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 9120 | Number of Logic Elements/Cells | 228000 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 17544192 |
Overview of EP4SGX230FF35C2X – Stratix® IV GX FPGA, 228000 logic elements
The EP4SGX230FF35C2X is an Intel Stratix IV GX field programmable gate array (FPGA) in a 1152-ball FCBGA package offering 228,000 logic elements and substantial on-chip RAM. It targets high-performance designs that require dense programmable logic, ample embedded memory, and a large number of I/O for system integration.
Architected for applications demanding high aggregate data bandwidth and advanced I/O capabilities, the device combines programmable fabric, DSP-oriented resources and family-level features such as high-speed transceivers and comprehensive clocking resources (as documented in the Stratix IV device handbook).
Key Features
- Programmable Logic 228,000 logic elements for complex digital designs and high-density implementation of custom logic functions.
- Embedded Memory Approximately 17.5 Mbits of on-chip RAM (17,544,192 bits) to support buffering, packet processing, and large LUT-based structures.
- I/O Capacity 564 I/O pins to interface with multiple peripherals, external memory, and high-speed lanes.
- High-Speed Transceiver and I/O Features Device family documentation lists high-speed transceiver features, differential I/O with DPA/soft-CDR, and external memory interface support for high-bandwidth system designs.
- Clocking and DSP Support Family-level architecture includes PLLs, clock networks, and DSP block resources to support signal processing and synchronous system designs.
- Power and Operating Conditions Core voltage supply range 870 mV to 930 mV and commercial operating temperature range 0°C to 85°C; surface-mount device optimized for board-level integration.
- Package 1152-ball BGA (1152-FBGA, 35×35) FCBGA package for a compact footprint and high pin count.
- Compliance RoHS compliant and specified as commercial grade.
Typical Applications
- High-Speed Networking and Telecom Use the device family’s high-speed transceiver features and high aggregate data bandwidth to implement switching, packet processing, and protocol bridging functions.
- Digital Signal Processing Leverage the FPGA’s DSP resources and large embedded RAM for real-time filtering, modulation/demodulation and algorithm acceleration.
- External Memory Interfaces Implement memory controllers and interface logic using the device’s extensive I/O and family-supported external memory interface features.
- Custom High-Density Logic Deploy complex state machines, datapaths, and glue logic in systems that require large programmable capacity and many I/O.
Unique Advantages
- High logic capacity: 228,000 logic elements provide headroom for large, integrated designs without partitioning across multiple devices.
- Substantial on-chip RAM: Approximately 17.5 Mbits of embedded memory reduces dependence on external buffering and simplifies board-level memory design.
- Extensive I/O count: 564 I/O pins enable broad peripheral connectivity and support for multi-lane interfaces.
- Compact, high-pin-count package: 1152-ball FCBGA allows dense routing and high signal integrity in a single-package solution.
- Commercial-grade operating range: 0°C to 85°C and RoHS compliance support standard industrial and commercial applications while meeting environmental restrictions.
- Family-level system features: Architecture documentation highlights PLLs, clock networks, DSP blocks and high-speed transceiver features for scalable system integration.
Why Choose EP4SGX230FF35C2X?
The EP4SGX230FF35C2X combines high logic density, significant embedded memory and a large I/O complement in a compact 1152-ball FCBGA package, making it suited for complex, bandwidth-intensive designs. Its documented family features — including DSP blocks, clocking resources and high-speed transceiver capabilities — support integration of compute, buffering and high-speed interfaces in a single FPGA.
This device is appropriate for design teams and OEMs building commercial-grade networking, signal processing, and high-performance interface applications who need a scalable, high-capacity programmable platform with clear electrical and thermal operating parameters.
Request a quote or submit a pricing request to obtain availability and lead-time details for EP4SGX230FF35C2X.

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