EP4SGX230FF35C2X

IC FPGA 564 I/O 1152FBGA
Part Description

Stratix® IV GX Field Programmable Gate Array (FPGA) IC 564 17544192 228000 1152-BBGA, FCBGA

Quantity 556 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1152-FBGA (35x35)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1152-BBGA, FCBGANumber of I/O564Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs9120Number of Logic Elements/Cells228000
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits17544192

Overview of EP4SGX230FF35C2X – Stratix® IV GX FPGA, 228000 logic elements

The EP4SGX230FF35C2X is an Intel Stratix IV GX field programmable gate array (FPGA) in a 1152-ball FCBGA package offering 228,000 logic elements and substantial on-chip RAM. It targets high-performance designs that require dense programmable logic, ample embedded memory, and a large number of I/O for system integration.

Architected for applications demanding high aggregate data bandwidth and advanced I/O capabilities, the device combines programmable fabric, DSP-oriented resources and family-level features such as high-speed transceivers and comprehensive clocking resources (as documented in the Stratix IV device handbook).

Key Features

  • Programmable Logic  228,000 logic elements for complex digital designs and high-density implementation of custom logic functions.
  • Embedded Memory  Approximately 17.5 Mbits of on-chip RAM (17,544,192 bits) to support buffering, packet processing, and large LUT-based structures.
  • I/O Capacity  564 I/O pins to interface with multiple peripherals, external memory, and high-speed lanes.
  • High-Speed Transceiver and I/O Features  Device family documentation lists high-speed transceiver features, differential I/O with DPA/soft-CDR, and external memory interface support for high-bandwidth system designs.
  • Clocking and DSP Support  Family-level architecture includes PLLs, clock networks, and DSP block resources to support signal processing and synchronous system designs.
  • Power and Operating Conditions  Core voltage supply range 870 mV to 930 mV and commercial operating temperature range 0°C to 85°C; surface-mount device optimized for board-level integration.
  • Package  1152-ball BGA (1152-FBGA, 35×35) FCBGA package for a compact footprint and high pin count.
  • Compliance  RoHS compliant and specified as commercial grade.

Typical Applications

  • High-Speed Networking and Telecom  Use the device family’s high-speed transceiver features and high aggregate data bandwidth to implement switching, packet processing, and protocol bridging functions.
  • Digital Signal Processing  Leverage the FPGA’s DSP resources and large embedded RAM for real-time filtering, modulation/demodulation and algorithm acceleration.
  • External Memory Interfaces  Implement memory controllers and interface logic using the device’s extensive I/O and family-supported external memory interface features.
  • Custom High-Density Logic  Deploy complex state machines, datapaths, and glue logic in systems that require large programmable capacity and many I/O.

Unique Advantages

  • High logic capacity: 228,000 logic elements provide headroom for large, integrated designs without partitioning across multiple devices.
  • Substantial on-chip RAM: Approximately 17.5 Mbits of embedded memory reduces dependence on external buffering and simplifies board-level memory design.
  • Extensive I/O count: 564 I/O pins enable broad peripheral connectivity and support for multi-lane interfaces.
  • Compact, high-pin-count package: 1152-ball FCBGA allows dense routing and high signal integrity in a single-package solution.
  • Commercial-grade operating range: 0°C to 85°C and RoHS compliance support standard industrial and commercial applications while meeting environmental restrictions.
  • Family-level system features: Architecture documentation highlights PLLs, clock networks, DSP blocks and high-speed transceiver features for scalable system integration.

Why Choose EP4SGX230FF35C2X?

The EP4SGX230FF35C2X combines high logic density, significant embedded memory and a large I/O complement in a compact 1152-ball FCBGA package, making it suited for complex, bandwidth-intensive designs. Its documented family features — including DSP blocks, clocking resources and high-speed transceiver capabilities — support integration of compute, buffering and high-speed interfaces in a single FPGA.

This device is appropriate for design teams and OEMs building commercial-grade networking, signal processing, and high-performance interface applications who need a scalable, high-capacity programmable platform with clear electrical and thermal operating parameters.

Request a quote or submit a pricing request to obtain availability and lead-time details for EP4SGX230FF35C2X.

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