EP4SGX230DF29I4N

The EP4SGX230DF29I4N is a Stratix® IV GX Field Programmable Gate Array (FPGA) manufactured by Intel in a 780-BBGA FCBGA (29×29) package. It provides a high-density programmable fabric with 228,000 logic elements, approximately 17.5 Mbits of embedded memory, and 372 general-purpose I/O pins.

Designed for applications that require substantial on-chip logic and memory capacity, this industrial-grade FPGA operates across a wide ambient temperature range and supports low-voltage core supply operation between 870 mV and 930 mV.

Key Features

• Core Logic — 228,000 logic elements to implement large-scale combinational and sequential logic functions for complex digital designs.
• Embedded Memory — Approximately 17.5 Mbits of on-chip RAM for buffering, lookup tables, and state storage within the FPGA fabric.
• I/O Capability — 372 I/O pins to support extensive peripheral connectivity and multi-channel interface implementations.
• Package — 780-BBGA, FCBGA package (supplier device package: 780-FBGA, 29×29) for compact, high-density board integration.
• Power — Core voltage supply range of 870 mV to 930 mV enabling low-voltage operation of the FPGA core.
• Thermal and Environmental — Industrial-grade device rated for operation from −40 °C to 100 °C for deployment in a wide range of ambient conditions.
• Mounting — Surface mount package suitable for modern PCB assembly flows.
• Compliance — RoHS compliant, meeting common environmental requirements for electronic components.

Typical Applications

• High-density digital implementations — Leverages 228,000 logic elements for complex custom logic, protocol handling, and state machines.
• On-chip buffering and data storage — Approximately 17.5 Mbits of embedded memory supports packet buffering, FIFOs, and lookup tables.
• Multi-channel I/O systems — 372 I/O pins accommodate designs that require extensive peripheral interfacing and parallel data paths.
• Thermally demanding environments — Industrial operating range (−40 °C to 100 °C) for deployment where wider temperature tolerance is required.

Unique Advantages

• High logic density: 228,000 logic elements enable consolidation of multiple functions into a single device, reducing PCB count and BOM complexity.
• Substantial on-chip memory: Roughly 17.5 Mbits of embedded RAM lowers dependence on external memory for many buffering and processing tasks.
• Extensive I/O: 372 I/O pins provide flexibility for multi-interface designs and high parallelism without immediate need for external expanders.
• Industrial temperature rating: Operation from −40 °C to 100 °C supports applications that require wider thermal margins.
• Compact FCBGA package: 780-BBGA (29×29) offers a space-efficient footprint for high-density system designs.
• RoHS compliant: Conforms to environmental restrictions for lead-free manufacturing and regulatory requirements.

Why Choose EP4SGX230DF29I4N?

The EP4SGX230DF29I4N delivers a combination of high logic element count, significant embedded memory, and a large I/O complement in a compact 780-BBGA FCBGA package from Intel. Its industrial temperature rating and low-voltage core supply range make it appropriate for designs that need reliable, high-capacity programmable logic in challenging environments.

This device is suited to engineering teams seeking to integrate substantial digital functionality and on-chip memory into a single FPGA footprint while preserving board area and meeting RoHS requirements.

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