EP4SGX230DF29I3

IC FPGA 372 I/O 780FBGA
Part Description

Stratix® IV GX Field Programmable Gate Array (FPGA) IC 372 17544192 228000 780-BBGA, FCBGA

Quantity 1,292 Available (as of May 6, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package780-FBGA (29x29)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case780-BBGA, FCBGANumber of I/O372Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs9120Number of Logic Elements/Cells228000
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits17544192

Overview of EP4SGX230DF29I3 – Stratix IV GX FPGA, 228,000 logic elements

The EP4SGX230DF29I3 is a Stratix® IV GX Field Programmable Gate Array (FPGA) IC from Intel. It implements the Stratix IV GX architecture and is targeted at systems that require high logic density, extensive I/O and advanced on-chip resources.

Built for data‑intensive and industrial embedded designs, the device combines a large programmable fabric with embedded memory and family-level features such as high‑speed transceiver support, DSP blocks and flexible clocking to address high‑bandwidth, protocol‑diverse applications.

Key Features

  • Core Logic — 228,000 logic elements provide substantial programmable fabric for complex digital designs.
  • Embedded Memory — Approximately 16.75 Mbits of on‑chip RAM (17,544,192 total RAM bits) for local buffering, FIFOs and implementation of memory‑intensive functions.
  • I/O Density and Interfaces — 372 I/O pins support broad system connectivity; device family documentation highlights support for high‑speed differential I/O and a wide range of protocol options.
  • Transceivers and DSP — Part of the Stratix IV GX family which includes high‑speed transceiver features and dedicated DSP resources as described in the device handbook.
  • Clocking and PLLs — Architecture includes advanced clock networks and PLL resources for high‑performance timing and clock management (as noted in the device handbook).
  • Power and Temperature — Core voltage supply range of 870 mV to 930 mV and an industrial operating temperature range of −40 °C to 100 °C for deployment in demanding environments.
  • Package and Mounting — 780‑BBGA FCBGA package (supplier package: 780‑FBGA, 29 × 29) with surface‑mount mounting for board‑level integration.
  • Environmental Compliance — RoHS compliant.

Typical Applications

  • High‑speed communications and networking — Use the Stratix IV GX architecture and high‑speed transceiver capabilities to handle protocol‑diverse, high‑bandwidth data paths.
  • Digital signal processing — On‑chip DSP blocks and significant embedded RAM support real‑time signal processing and acceleration tasks.
  • Memory interface and controller designs — Embedded memory and documented external memory interface support facilitate implementation of memory controllers and buffering subsystems.
  • Industrial embedded systems — Industrial grade temperature range and robust I/O density suit control, instrumentation and factory automation applications.

Unique Advantages

  • High logic capacity: 228,000 logic elements enable implementation of large, complex custom logic and multi‑function systems on a single device.
  • Substantial on‑chip RAM: Approximately 16.75 Mbits of embedded memory reduces reliance on external memory for many buffering and storage needs.
  • Dense I/O footprint: 372 I/O pins provide flexibility for interfacing multiple peripherals, buses and high‑speed links without excessive external glue logic.
  • Industrial robustness: −40 °C to 100 °C operating range and surface‑mount 780‑BBGA package support deployment in industrial environments.
  • Low‑voltage core: 870 mV to 930 mV supply range aligns with optimized core power domains for power‑aware system design.
  • Standards‑aligned family features: As a Stratix IV GX device, it incorporates family‑level capabilities (transceivers, DSP, clocking) documented in the device handbook for high‑bandwidth designs.

Why Choose EP4SGX230DF29I3?

The EP4SGX230DF29I3 positions itself as a high‑capacity, industrial‑grade FPGA for engineers who need significant programmable resources, on‑chip memory and extensive I/O in a single device. Its inclusion in the Stratix IV GX family means designers can leverage family‑level features such as high‑speed transceivers, DSP blocks and advanced clocking described in the device handbook.

This device is well suited for teams developing bandwidth‑focused communications, signal processing and industrial embedded systems that require a balance of performance, integration and environmental resilience. Backed by Intel’s Stratix IV documentation and ecosystem, it provides a scalable platform for complex, long‑lifecycle designs.

Request a quote or submit a procurement inquiry to check availability and receive pricing and lead‑time information for EP4SGX230DF29I3.

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