EP4SGX230DF29C4N

The EP4SGX230DF29C4N is a Stratix IV GX field-programmable gate array (FPGA) IC from Intel. It delivers a high-density programmable fabric with a large complement of on-chip memory and extensive I/O for designs requiring substantial logic capacity and high aggregate data bandwidth.

With 228,000 logic elements, approximately 17.5 Mbits of embedded memory and 372 I/O pins, this device is targeted at applications that need high-performance logic, complex interfacing and advanced system integration while operating within commercial temperature and voltage ranges.

Key Features

• Logic Capacity — 228,000 logic elements and 9,120 logic fabric blocks provide dense programmable resources for complex digital designs.
• Embedded Memory — Total on-chip RAM of 17,544,192 bits (approximately 17.5 Mbits) to support buffering, packet processing and local data storage.
• I/O and System Interfaces — 372 user I/O pins suitable for broad external interfacing and multi-channel connectivity.
• Stratix IV GX Architecture — Device-family features documented in the Stratix IV handbook include high-speed transceiver capabilities, DSP blocks, PLLs and rich clock-network support for high-throughput designs.
• Power and Core Voltage — Core voltage supply range of 870 mV to 930 mV, enabling predictable power budgeting at the FPGA core.
• Package and Mounting — 780-FBGA (29×29) surface-mount package (780-BBGA, FCBGA supplier package) for board-level integration.
• Operating Range and Grade — Commercial grade device with an operating temperature range of 0 °C to 85 °C.
• Environmental Compliance — RoHS compliant.

Typical Applications

• High‑Performance Networking — Use the device's large logic capacity and documented high‑speed transceiver features for packet processing, switching and aggregation functions.
• Data‑Plane Acceleration — Implement custom datapath logic and DSP functions using the dense logic fabric and embedded memory for buffering and low-latency processing.
• High‑Speed I/O Bridging — Leverage 372 I/Os and Stratix IV I/O features for protocol conversion, multi‑lane interfaces and external memory interfacing.
• System Integration and Prototyping — Integrate complex control and signal-processing blocks on a single device for rapid prototyping and subsystem consolidation.

Unique Advantages

• High Logic Density: 228,000 logic elements enable implementation of large-scale custom logic and multiple concurrent functions on a single device.
• Substantial On‑Chip Memory: Approximately 17.5 Mbits of embedded RAM reduces reliance on external memory for many buffering and storage tasks.
• Extensive I/O Count: 372 I/Os support complex board-level interfacing and multichannel connectivity without immediate need for additional bridge devices.
• Documented Architecture: Stratix IV GX family documentation details high-speed transceiver, DSP and clocking features to aid system architects in design planning.
• Compact Surface‑Mount Package: 780-FBGA (29×29) packaging provides a dense footprint suitable for space-conscious board designs.
• Commercial Temperature Rating: Designed for 0 °C to 85 °C operation where commercial-grade qualification is required.

Why Choose EP4SGX230DF29C4N?

The EP4SGX230DF29C4N combines high logic capacity, substantial embedded memory and comprehensive I/O in the Stratix IV GX device family form factor. It is well suited for engineers and system designers who need a programmable platform with documented high‑speed features and the resources to implement complex data‑plane, networking or signal‑processing functions.

Backed by the Stratix IV device family handbook documentation, this part provides a predictable hardware foundation for designs that require scalable logic and memory resources in a commercial-grade package.

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