EP4SGX230DF29C4
| Part Description |
Stratix® IV GX Field Programmable Gate Array (FPGA) IC 372 17544192 228000 780-BBGA, FCBGA |
|---|---|
| Quantity | 543 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 780-FBGA (29x29) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 780-BBGA, FCBGA | Number of I/O | 372 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 9120 | Number of Logic Elements/Cells | 228000 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 17544192 |
Overview of EP4SGX230DF29C4 – Stratix® IV GX FPGA, 228,000 logic elements, 780-FBGA (29×29)
The EP4SGX230DF29C4 is a Stratix IV GX field-programmable gate array (FPGA) in a 780-FBGA (29×29) surface-mount package. It provides a high-density programmable fabric with integrated memory, DSP resources and on-chip features targeted at high-bandwidth, protocol-rich designs.
With 228,000 logic elements, approximately 17.5 Mbits of embedded memory, and 372 I/O pins, this commercial-grade device is intended for applications that require dense logic, extensive I/O and advanced transceiver and clocking capabilities as described in the Stratix IV device family documentation.
Key Features
- Stratix IV GX architecture Includes family-level features such as high-speed transceiver support and architecture elements documented for Stratix IV devices.
- Logic density 228,000 logic elements provide a large, flexible fabric for implementing complex digital designs and system integration.
- Embedded memory Approximately 17.5 Mbits of on-chip RAM to support buffering, packet processing and intermediate data storage.
- I/O and high-speed interfaces 372 I/O pins and device-level support for high-speed differential I/O (including DPA and Soft-CDR capabilities referenced in the device handbook).
- Clocking and PLLs Documented Stratix IV features include flexible clock networks and programmable PLLs for multi-domain clocking and synchronization.
- DSP and signal-processing resources Device family documentation lists dedicated DSP blocks suitable for implementing signal-processing and arithmetic-intensive functions.
- Package and mounting 780-BBGA (780-FBGA, 29×29) surface-mount package suitable for dense board-level integration.
- Power and supply Core supply specified from 870 mV to 930 mV for the device.
- Operating conditions and compliance Commercial grade operation from 0 °C to 85 °C and RoHS-compliant construction.
Typical Applications
- High-performance networking Packet processing, protocol bridging and aggregation where high logic density and extensive I/O support are required.
- Telecommunications and datacom Designs that leverage high-speed transceivers and flexible clocking for protocol implementation and link aggregation.
- Broadcast and video processing High-throughput signal paths and DSP acceleration using the device's embedded memory and DSP resources.
- Test and measurement equipment Custom processing pipelines and interface-rich boards that benefit from the large logic array and numerous I/O.
Unique Advantages
- High logic capacity: 228,000 logic elements enable implementation of complex systems-on-FPGA and deep integration of functions.
- Substantial on-chip memory: Approximately 17.5 Mbits of embedded RAM reduce external memory dependence for buffering and local storage.
- Extensive I/O count: 372 I/O pins provide flexible external interfacing and board-level connectivity options.
- Advanced family-level transceiver and clocking features: Stratix IV GX documentation describes high-speed differential I/O and flexible clock networks useful for multi-protocol designs.
- Board-friendly package: 780-FBGA (29×29) surface-mount packaging suits compact, high-density PCB layouts.
- Commercial operating range and RoHS compliance: Rated for 0 °C to 85 °C operation and RoHS-compliant for global assembly requirements.
Why Choose EP4SGX230DF29C4?
The EP4SGX230DF29C4 positions itself as a high-density Stratix IV GX FPGA option for engineers who need a large programmable fabric combined with significant embedded memory, abundant I/O and device-level support for high-speed serial interfaces and clocking. Its configuration and documented family features make it suitable for advanced networking, communications and signal-processing designs that require on-chip resources and flexible integration.
For teams focused on scalable, integration-forward architectures, this device provides the fabric, memory and I/O needed to consolidate functions on a single FPGA while maintaining commercial operating specifications and RoHS compliance.
Request a quote or submit an inquiry to obtain pricing and availability for EP4SGX230DF29C4.

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