EP4SGX230DF29C4

IC FPGA 372 I/O 780FBGA
Part Description

Stratix® IV GX Field Programmable Gate Array (FPGA) IC 372 17544192 228000 780-BBGA, FCBGA

Quantity 543 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package780-FBGA (29x29)GradeCommercialOperating Temperature0°C – 85°C
Package / Case780-BBGA, FCBGANumber of I/O372Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs9120Number of Logic Elements/Cells228000
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits17544192

Overview of EP4SGX230DF29C4 – Stratix® IV GX FPGA, 228,000 logic elements, 780-FBGA (29×29)

The EP4SGX230DF29C4 is a Stratix IV GX field-programmable gate array (FPGA) in a 780-FBGA (29×29) surface-mount package. It provides a high-density programmable fabric with integrated memory, DSP resources and on-chip features targeted at high-bandwidth, protocol-rich designs.

With 228,000 logic elements, approximately 17.5 Mbits of embedded memory, and 372 I/O pins, this commercial-grade device is intended for applications that require dense logic, extensive I/O and advanced transceiver and clocking capabilities as described in the Stratix IV device family documentation.

Key Features

  • Stratix IV GX architecture Includes family-level features such as high-speed transceiver support and architecture elements documented for Stratix IV devices.
  • Logic density 228,000 logic elements provide a large, flexible fabric for implementing complex digital designs and system integration.
  • Embedded memory Approximately 17.5 Mbits of on-chip RAM to support buffering, packet processing and intermediate data storage.
  • I/O and high-speed interfaces 372 I/O pins and device-level support for high-speed differential I/O (including DPA and Soft-CDR capabilities referenced in the device handbook).
  • Clocking and PLLs Documented Stratix IV features include flexible clock networks and programmable PLLs for multi-domain clocking and synchronization.
  • DSP and signal-processing resources Device family documentation lists dedicated DSP blocks suitable for implementing signal-processing and arithmetic-intensive functions.
  • Package and mounting 780-BBGA (780-FBGA, 29×29) surface-mount package suitable for dense board-level integration.
  • Power and supply Core supply specified from 870 mV to 930 mV for the device.
  • Operating conditions and compliance Commercial grade operation from 0 °C to 85 °C and RoHS-compliant construction.

Typical Applications

  • High-performance networking Packet processing, protocol bridging and aggregation where high logic density and extensive I/O support are required.
  • Telecommunications and datacom Designs that leverage high-speed transceivers and flexible clocking for protocol implementation and link aggregation.
  • Broadcast and video processing High-throughput signal paths and DSP acceleration using the device's embedded memory and DSP resources.
  • Test and measurement equipment Custom processing pipelines and interface-rich boards that benefit from the large logic array and numerous I/O.

Unique Advantages

  • High logic capacity: 228,000 logic elements enable implementation of complex systems-on-FPGA and deep integration of functions.
  • Substantial on-chip memory: Approximately 17.5 Mbits of embedded RAM reduce external memory dependence for buffering and local storage.
  • Extensive I/O count: 372 I/O pins provide flexible external interfacing and board-level connectivity options.
  • Advanced family-level transceiver and clocking features: Stratix IV GX documentation describes high-speed differential I/O and flexible clock networks useful for multi-protocol designs.
  • Board-friendly package: 780-FBGA (29×29) surface-mount packaging suits compact, high-density PCB layouts.
  • Commercial operating range and RoHS compliance: Rated for 0 °C to 85 °C operation and RoHS-compliant for global assembly requirements.

Why Choose EP4SGX230DF29C4?

The EP4SGX230DF29C4 positions itself as a high-density Stratix IV GX FPGA option for engineers who need a large programmable fabric combined with significant embedded memory, abundant I/O and device-level support for high-speed serial interfaces and clocking. Its configuration and documented family features make it suitable for advanced networking, communications and signal-processing designs that require on-chip resources and flexible integration.

For teams focused on scalable, integration-forward architectures, this device provides the fabric, memory and I/O needed to consolidate functions on a single FPGA while maintaining commercial operating specifications and RoHS compliance.

Request a quote or submit an inquiry to obtain pricing and availability for EP4SGX230DF29C4.

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