EP4SGX230DF29C2XN

The EP4SGX230DF29C2XN is a Stratix IV GX field‑programmable gate array (FPGA) in a 780‑ball BGA FCBGA package designed for surface‑mount assembly. It delivers high logic density and on‑chip memory together with a broad set of device‑level features documented in the Stratix IV device handbook.

With 228,000 logic elements, approximately 17.5 Mbits of embedded memory and 372 user I/O pins, this commercial‑grade FPGA addresses designs that require substantial programmable logic, multi‑bank I/O and integrated system‑level resources such as PLLs, transceiver and DSP block capabilities described in the device documentation.

Key Features

• Logic Capacity — 228,000 logic elements to implement large custom logic, state machines and datapath designs.
• Embedded Memory — Approximately 17.5 Mbits of on‑chip RAM for FIFOs, buffering and on‑chip data storage.
• I/O Resources — 372 user I/O pins to support high‑pin‑count interfaces and multi‑lane connectivity.
• Package & Mounting — 780‑BBGA FCBGA (supplier package: 780‑FBGA, 29×29) in a surface‑mount form factor suitable for dense PCB layouts.
• Power Supply — Core operating voltage range of 870 mV to 930 mV as specified for device operation.
• Temperature & Grade — Commercial grade device rated for 0 °C to 85 °C operating temperature.
• Device Handbook Features — Family documentation includes DC and switching characteristics, transceiver performance specifications, PLL and clock‑tree specifications, DSP block and TriMatrix memory block specifications, configuration and JTAG details, and power consumption guidance.
• Environmental Compliance — RoHS compliant.

Typical Applications

• High‑performance DSP systems — Leverage the device family’s DSP block and abundant logic elements for compute‑intensive signal processing tasks.
• High‑pin‑count I/O subsystems — Utilize 372 I/Os for multi‑lane interfaces, parallel buses and complex peripheral connectivity.
• Custom protocol and transceiver designs — Use the Stratix IV device documentation covering transceiver performance and PLL resources when implementing high‑speed serial links and clocking schemes.
• Embedded memory‑centric designs — On‑chip RAM (approximately 17.5 Mbits) supports buffering, packet storage and other memory‑intensive functions.

Unique Advantages

• High logic density: 228,000 logic elements provide capacity for large, integrated designs without immediate partitioning across multiple devices.
• Substantial on‑chip memory: Approximately 17.5 Mbits of embedded RAM reduce dependence on external memory for many buffering and storage tasks.
• Extensive I/O: 372 user I/Os enable complex interface mixes and high channel counts on a single device.
• Comprehensive device documentation: The Stratix IV device handbook supplies detailed specifications for DC characteristics, PLLs, clock trees, DSP blocks, transceivers and configuration options to support engineering validation.
• Compact, manufacturable package: 780‑BBGA (29×29) FCBGA surface‑mount package supports dense PCB layouts while offering a standardized BGA footprint.
• Regulatory cleanliness: RoHS compliance supports use in environments requiring restricted‑substance conformance.

Why Choose EP4SGX230DF29C2XN?

The EP4SGX230DF29C2XN positions itself as a high‑capacity, commercially graded Stratix IV GX FPGA suitable for designs that demand large programmable logic resources, significant embedded memory and a high I/O count in a single package. Its documented family features — including PLLs, transceiver and DSP block specifications — help bridge system‑level requirements with device‑level implementation details.

This device is well suited to engineers developing complex digital signal processing, multi‑interface communications and other logic‑intensive applications that benefit from on‑chip memory and comprehensive device documentation. The commercial temperature grade and RoHS compliance make it appropriate for a wide range of standard commercial deployments.

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