EP4SGX180KF40I4N
| Part Description |
Stratix® IV GX Field Programmable Gate Array (FPGA) IC 744 13954048 175750 1517-BBGA, FCBGA |
|---|---|
| Quantity | 31 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 1517-FBGA (40x40) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1517-BBGA, FCBGA | Number of I/O | 744 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 7030 | Number of Logic Elements/Cells | 175750 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 13954048 |
Overview of EP4SGX180KF40I4N – Stratix® IV GX FPGA
The EP4SGX180KF40I4N is a Stratix IV GX field programmable gate array (FPGA) IC from Intel, delivered in a 1517-BBGA FCBGA package for surface-mount assembly. It provides a high logic capacity and significant embedded memory, making it suitable for high-bandwidth, signal-processing and system-integration applications within industrial operating environments.
As a member of the Stratix IV GX family, the device targets designs that require large programmable logic resources, extensive I/O, and on-chip memory while operating across an industrial temperature range and low-voltage supply window.
Key Features
- Core Capacity — 175,750 logic elements providing substantial programmable fabric for complex digital logic and control functions.
- Embedded Memory — Approximately 13.95 Mbits of on-chip RAM for buffering, buffering engines, and memory-intensive logic.
- I/O Density — 744 user I/O pins to support broad peripheral and high-pin-count interface requirements.
- Stratix IV GX Family Features — Family-level capabilities include high-speed transceiver features, DSP blocks, PLLs, clock networks, and support for high-speed differential I/O with DPA and Soft-CDR as documented in the Stratix IV device handbook.
- Power — Defined core voltage supply range from 870 mV to 930 mV for the device core.
- Package & Mounting — 1517-BBGA (supplier package: 1517-FBGA, 40×40) in a surface-mount format for dense board implementations.
- Industrial Grade Temperature — Rated for operation from −40 °C to 100 °C, suited to industrial temperature environments.
- Diagnostics & System Integration — The Stratix IV documentation references diagnostic features, external memory interface support, and system-level integration facilities for complex designs.
Typical Applications
- High-Bandwidth Communications — Deploy transceiver and I/O resources to implement high aggregate data bandwidth links and protocol interfaces.
- Digital Signal Processing — Use embedded DSP blocks and on-chip RAM for real-time signal processing and filtering pipelines.
- External Memory Interfaces — Implement controllers and interface logic for external memory systems leveraging on-chip memory and clocking resources.
- System Integration & Prototyping — Integrate complex logic, multiple interfaces, and clocking networks for system-level prototypes and industrial control platforms.
Unique Advantages
- High Logic Density: 175,750 logic elements enable consolidation of large designs into a single FPGA device, reducing board-level complexity.
- Substantial On-Chip RAM: Approximately 13.95 Mbits of embedded memory supports buffering and accelerator functions without immediate reliance on external memory.
- Extensive I/O Count: 744 I/Os provide flexibility for connecting wide buses, high-pin-count peripherals, or multiple parallel interfaces.
- Industrial Temperature Range: −40 °C to 100 °C rating supports deployment in harsh or temperature-variable industrial environments.
- Stratix IV GX Family Capabilities: Family-level features such as high-speed transceivers, DSP blocks, PLLs and advanced I/O techniques enable implementation of performance-focused designs.
- Compact, High-Density Package: 1517-FBGA (40×40) surface-mount package supports dense PCB layouts and high integration.
Why Choose EP4SGX180KF40I4N?
The EP4SGX180KF40I4N positions itself for designs that demand a combination of large programmable logic, significant embedded memory, and extensive I/O in an industrial-temperature FPGA. Its Stratix IV GX family architecture brings transceiver, DSP, and clocking capabilities useful for high-bandwidth communications, signal processing, and integrated system designs.
Engineers specifying this device can leverage its documented family features and the device’s raw resources to consolidate multi-component designs into a single, robust FPGA package suitable for industrial deployments.
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