EP4SGX180KF40I3N

The EP4SGX180KF40I3N is a Stratix IV GX FPGA offering a high count of programmable logic and embedded memory in a BGA package. It provides 175,750 logic elements, approximately 14 Mbits of embedded RAM, and 744 I/Os to address designs that require large on-chip resources and dense I/O connectivity.

Built for industrial environments, this device operates over a wide temperature range and uses a low-voltage core supply, making it suitable for applications that demand reliable, compact programmable logic in a surface-mount FCBGA package.

Key Features

• Logic Capacity 175,750 logic elements for implementing large, complex digital designs.
• Embedded Memory Approximately 14 Mbits of on-chip RAM to support buffering, lookup tables, and data storage within the FPGA fabric.
• High I/O Count 744 general-purpose I/Os to support dense external interfacing and multi-channel designs.
• Power and Core Voltage Core supply range of 870 mV to 930 mV, enabling operation within the specified low-voltage domain.
• Package and Mounting 1517-BBGA (1517-FBGA, 40×40) FCBGA package designed for surface-mount assembly to conserve board area.
• Industrial Temperature Grade Rated for operation from −40 °C to 100 °C for deployment in industrial environments.
• RoHS Compliant Meets RoHS requirements for lead-free, environmentally compliant manufacturing.

Typical Applications

• High-density digital processing — Implement large-scale logic functions and custom processing pipelines using the device's extensive logic elements and embedded RAM.
• Multi-channel I/O aggregation — Aggregate and manage numerous serial or parallel interfaces with the 744 available I/Os.
• Embedded memory buffering — Use the approximately 14 Mbits of on-chip RAM for data buffering, packet queuing, or intermediate storage in streaming applications.
• Industrial control and automation — Deploy in systems requiring industrial temperature operation and robust surface-mount BGA packaging.

Unique Advantages

• High logic density: 175,750 logic elements deliver capacity for complex, resource-intensive designs without external logic expansion.
• Substantial on-chip memory: Approximately 14 Mbits of embedded RAM reduces reliance on external memory, lowering BOM complexity and board routing.
• Extensive I/O resources: 744 I/Os enable broad peripheral connectivity and parallel interfacing for demanding systems.
• Industrial-ready thermal range: −40 °C to 100 °C rating supports deployment in temperature-challenging environments.
• Compact surface-mount BGA package: 1517-FBGA (40×40) package allows high-density PCB integration with proven assembly methods.
• Low-voltage core operation: 870 mV–930 mV supply range supports efficient core power design and integration with system power rails.

Why Choose EP4SGX180KF40I3N?

The EP4SGX180KF40I3N combines large programmable logic capacity, significant embedded RAM, and a very high I/O count within an industrial-grade FCBGA package. These attributes make it suited to designs that require on-chip resources and dense connectivity while maintaining surface-mount assembly compatibility.

This device is aimed at engineering teams building complex digital systems that benefit from integrated memory, many I/Os, and an industrial operating range—providing design scalability and compact board-level implementation in a RoHS-compliant package.

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