EP4SGX180KF40I4

IC FPGA 744 I/O 1517FBGA
Part Description

Stratix® IV GX Field Programmable Gate Array (FPGA) IC 744 13954048 175750 1517-BBGA, FCBGA

Quantity 157 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1517-FBGA (40x40)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1517-BBGA, FCBGANumber of I/O744Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs7030Number of Logic Elements/Cells175750
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits13954048

Overview of EP4SGX180KF40I4 – Stratix IV GX Field Programmable Gate Array (FPGA), 1517-FBGA (40×40), Industrial

The EP4SGX180KF40I4 is a Stratix IV GX series FPGA offering a high logic capacity and on-chip memory for demanding, high-bandwidth designs. It uses the Stratix IV GX architecture and is intended for applications that require extensive programmable logic, large embedded memory, and abundant I/O connectivity.

With 175,750 logic elements, approximately 13.95 Mbits of embedded memory, and 744 I/O pins, this industrial-grade device targets complex digital signal processing, protocol bridging, and high-throughput system integration while operating across a wide voltage and temperature range.

Key Features

  • Core Logic  Provides 175,750 logic elements to implement large-scale combinational and sequential logic functions.
  • On‑chip Memory  Approximately 13.95 Mbits of embedded RAM to support buffering, packet processing, and state storage for complex designs.
  • I/O Capacity  744 I/O pins for extensive interfacing to peripherals, memory devices, and high-speed links.
  • Stratix IV GX Architecture  Built on the Stratix IV GX family with device-level features such as high-speed transceiver support and architecture building blocks described in the Stratix IV Device Handbook.
  • DSP and Clocking Resources  Includes dedicated digital signal processing and clock network features as part of the Stratix IV device family to support signal processing and timing-critical designs.
  • Power Supply  Operates from a core voltage range of 870 mV to 930 mV, enabling defined power planning for the FPGA core.
  • Package and Mounting  Supplied in a 1517-FBGA (40×40) package, surface-mount FCBGA format for high‑density board integration.
  • Operating Range  Industrial temperature grade with an operating range from −40 °C to 100 °C for use in demanding environments.
  • RoHS Compliant  Meets RoHS requirements for environmentally conscious designs.

Typical Applications

  • High‑Bandwidth Networking  Implements protocol bridging and packet processing using the large logic array, abundant I/O, and embedded memory to handle aggregate data flows.
  • Wireline and Telecom Systems  Supports systems that benefit from Stratix IV GX transceiver and clocking features alongside large FPGA fabric for protocol and interface logic.
  • Video and Broadcast Processing  Provides the logic and on‑chip RAM capacity for frame buffering, format conversion, and real‑time processing tasks.
  • Industrial Signal Processing  Combines DSP resources, extensive I/O, and industrial temperature rating for control, measurement, and data acquisition applications.

Unique Advantages

  • Large Logic Capacity: 175,750 logic elements enable integration of complex multi‑function designs into a single device, reducing board-level complexity.
  • Substantial Embedded Memory: Approximately 13.95 Mbits of on‑chip RAM supports buffering and stateful processing without immediate reliance on external memory.
  • Extensive I/O Count: 744 I/O pins provide flexibility to connect multiple peripherals, memory interfaces, and high-speed links directly to the FPGA.
  • Family Features for High-Speed Designs: Stratix IV GX architecture includes device features described for high-speed transceivers, clocking, and signal integrity to address high aggregate bandwidth requirements.
  • Industrial Temperature Rating: −40 °C to 100 °C operation offers robustness for temperature‑sensitive deployments.
  • Compact High‑Density Package: 1517‑FBGA (40×40) surface-mount package enables dense PCB layouts and high pin count in a single footprint.

Why Choose EP4SGX180KF40I4?

The EP4SGX180KF40I4 positions itself as a high‑capacity Stratix IV GX FPGA suited for designers who need substantial logic resources, significant on‑chip memory, and a large number of I/O for high‑throughput and signal‑processing applications. Its industrial temperature rating and RoHS compliance make it appropriate where environmental robustness and regulatory conformity are required.

As part of the Stratix IV family, the device is documented within the Stratix IV Device Handbook, providing design guidance and device-level details to support system integration and verification.

Request a quote or submit an inquiry for pricing and availability to evaluate the EP4SGX180KF40I4 for your next high‑performance FPGA design.

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