EP4SGX180KF40I3G

The EP4SGX180KF40I3G is an industrial-grade FPGA supplied by Intel, offered in a 1517-ball FCBGA package for surface-mount applications. It provides high logic density, substantial embedded memory, and a large I/O count for complex digital designs.

Series documentation (Stratix IV Device Handbook) highlights architecture features such as high-speed transceivers, embedded memory, DSP blocks and PLLs, positioning this device for high-bandwidth communications, signal processing and industrial systems that require robust integration and thermal tolerance.

Key Features

• Logic Capacity  Approximately 175,750 logic elements to support large, complex digital designs and custom logic implementations.
• Embedded Memory  Approximately 14 Mbits of on-chip RAM (total RAM bits: 13,954,048) to support buffering, FIFOs and local data storage without external memory for many tasks.
• I/O Density  744 user I/Os enabling broad connectivity to peripherals, memory interfaces and high-speed serial links.
• Series Architecture  Stratix IV family documentation indicates integrated features such as high-speed transceivers, DSP blocks and PLLs for protocol support and advanced signal processing.
• Package and Mounting  1517-BBGA / 1517-FBGA (40×40) ball-grid package, surface-mount design for PCB integration in space-constrained systems.
• Power  Specified core voltage range of 870 mV to 930 mV for the device core supply domain.
• Thermal and Grade  Industrial-grade device with an operating temperature range of −40°C to 100°C for use in demanding environments.
• Compliance  RoHS-compliant for environmental and regulatory considerations.

Typical Applications

• High-Bandwidth Communications  Used for protocol processing and aggregation where on-chip logic, embedded memory and high I/O counts support complex packet handling and serial interfaces.
• Signal Processing and DSP  Suitable for FPGA-accelerated filtering, transforms and fixed-point processing leveraging the family’s DSP and memory resources.
• Imaging and Video Systems  Implements large custom pipelines and buffering for video frame processing, interfacing to sensors and external memory through abundant I/Os.
• Industrial Control and Automation  Industrial temperature rating and high logic density enable programmable control, real-time processing and I/O aggregation in factory and process equipment.

Unique Advantages

• High integration in a single device: 175,750 logic elements and approximately 14 Mbits of embedded memory reduce the need for external logic and memory components.
• Extensive I/O capability: 744 I/Os provide flexibility for interfacing to high-pin-count peripherals, external memories and dense connector systems.
• Designed for demanding environments: Industrial-grade operation from −40°C to 100°C supports deployment in thermally challenging installations.
• Compact, production-ready package: 1517-ball FCBGA surface-mount package balances routing density and board-level footprint for compact system designs.
• Documented series capabilities: Stratix IV series documentation details high-speed transceivers, DSP resources and PLLs to assist system architects in planning high-performance implementations.
• Regulatory readiness: RoHS compliance simplifies environmental compliance for production deployments.

Why Choose EP4SGX180KF40I3G?

The EP4SGX180KF40I3G combines substantial logic capacity, significant on-chip memory and a very high I/O count in an industrial-temperature, surface-mount FCBGA package. It is suited to engineers designing bandwidth-intensive, compute-heavy or I/O-dense systems that require a programmable, field-upgradeable silicon element.

Backed by the Stratix IV series documentation, this device fits designs that prioritize integration and thermal robustness while leveraging established architecture features—such as high-speed transceiver support and DSP/memory resources—to accelerate time to market and simplify system partitioning.

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