EP4SGX230DF29C2X

The EP4SGX230DF29C2X is a Stratix® IV GX field programmable gate array (FPGA) from Intel. It combines a high-density logic fabric with substantial embedded memory and a large I/O count to address complex digital designs.

Documented in the Stratix IV device handbook, the family includes high-speed transceiver capabilities, DSP resources, and clocking features that make this device suitable for bandwidth- and logic-intensive applications across communications, instrumentation, and compute acceleration markets.

Key Features

• Core Logic — 228,000 logic elements for implementing large-scale combinational and sequential logic functions.
• Embedded Memory — Approximately 17.54 Mbits of on-chip RAM to support buffering, FIFOs, and local data storage.
• I/O Density — 372 I/O pins to support broad interfacing with peripherals and external memory devices.
• High‑Speed Transceiver & Bandwidth — Stratix IV GX family documentation highlights high-speed transceiver features and highest aggregate data bandwidth for protocol support and serial links.
• DSP and Timing Resources — Device handbook lists DSP blocks, clock networks, and PLLs to support signal processing and precise timing architectures.
• Power and Voltage — Core supply range specified at 870 mV to 930 mV for device power planning.
• Package & Mounting — 780-BBGA FCBGA surface-mount package; supplier device package: 780-FBGA (29×29) for compact, high-density board designs.
• Operating Grade & Temperature — Commercial grade operation from 0 °C to 85 °C.
• Compliance — RoHS compliant.

Typical Applications

• High‑performance networking — Use the device’s high-speed transceiver features and large logic/memory resources for packet processing, protocol bridging, and aggregation tasks.
• Data acquisition and test equipment — DSP blocks, substantial on-chip RAM, and abundant I/O enable real‑time capture, preprocessing, and streaming of measurement data.
• Video and imaging pipelines — Embedded memory and the dense logic fabric support frame buffering, pipeline processing, and custom image algorithms.
• Custom acceleration and compute offload — Large logic element count and DSP resources allow implementation of compute accelerators and hardware offloads for specialized workloads.

Unique Advantages

• High logic density: 228,000 logic elements provide the capacity to implement complex systems on a single device, reducing board-level complexity.
• Substantial on-chip RAM: Approximately 17.54 Mbits of embedded memory enables large local buffering and reduces dependence on external memory for many functions.
• Extensive I/O capability: 372 I/Os give flexible connectivity options for parallel interfaces, external memories, and peripheral devices.
• Designed for high-bandwidth designs: Stratix IV GX family documentation emphasizes high-speed transceivers and aggregate bandwidth, supporting demanding serial and protocol-oriented applications.
• Compact, high-density packaging: 780-BBGA FCBGA (780-FBGA, 29×29) surface-mount package supports board-space-constrained designs while providing high I/O count.
• Commercial temperature rating: Specified 0 °C to 85 °C operation fits standard commercial deployments and typical lab/production environments.

Why Choose EP4SGX230DF29C2X?

The EP4SGX230DF29C2X positions itself as a high-capacity FPGA solution within the Stratix IV GX family, offering a balance of logic density, embedded memory, and I/O to support complex, throughput‑oriented designs. Its documented family features—high-speed transceivers, DSP resources, and robust clocking—enable system architects to consolidate functions and streamline board-level design.

This device is appropriate for engineers and procurement teams designing commercial-grade networking, instrumentation, imaging, and acceleration systems who require a well-documented architecture and substantial on-chip resources from an established FPGA family.

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