EP4SGX230DF29C3G

The EP4SGX230DF29C3G is an Intel FPGA part documented in the Stratix IV Device Handbook. It provides a high-capacity programmable logic fabric with on-chip memory and a broad set of architecture features described for the Stratix IV family.

Targeted at designs that require high aggregate data bandwidth, flexible I/O and substantial embedded memory, this commercial-grade device supports applications across communications, signal processing and system integration where performance and integration matter.

Key Features

• Logic Capacity — 228,000 logic elements to implement complex digital logic and custom processors within the FPGA fabric.
• Embedded Memory — Approximately 17.54 Mbits of on-chip RAM for buffering, packet storage, and local data structures.
• I/O Density — 372 I/O pins to support wide external interface options and multiple parallel connections.
• Power Supply — Core voltage supply range of 870 mV to 930 mV for the device core.
• Package & Mounting — Available in a 780-ball FCBGA (29 × 29) package and surface-mount mounting for compact board-level integration.
• Operating Range & Grade — Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Standards & Documentation — Device family features and architecture are documented in the Stratix IV Device Handbook, including sections on high-speed transceivers, embedded memory, DSP blocks, PLLs and clock networks.
• Environmental Compliance — RoHS compliant.

Typical Applications

• High-Bandwidth Networking — Implements data-path logic and buffering for networking equipment that requires high aggregate bandwidth and flexible I/O.
• Digital Signal Processing — Leverages abundant logic elements and embedded memory for DSP-related tasks such as video processing or channelized signal chains.
• External Memory Interfaces — Acts as a bridge or controller for systems requiring programmable external memory interfaces and system integration features.
• Test & Measurement — Provides programmable logic capacity and I/O density for custom measurement instruments and data acquisition systems.

Unique Advantages

• High Logic Density: 228,000 logic elements enable complex, large-scale designs without partitioning across multiple devices.
• Substantial On-Chip Memory: Approximately 17.54 Mbits of embedded RAM reduce external memory dependency and simplify data buffering.
• Wide I/O Count: 372 I/Os support multi-channel interfaces and flexible board-level connectivity.
• Documented Stratix IV Feature Set: Architecture features such as high-speed transceivers, DSP blocks, PLLs and clock networks are described in the Stratix IV Device Handbook for design planning and integration.
• Compact, Surface-Mount Package: 780-ball FCBGA (29 × 29) package supports dense PCB layouts while maintaining thermal and mechanical compatibility for surface-mount assembly.
• Regulatory Compliance: RoHS compliant to meet common environmental requirements.

Why Choose EP4SGX230DF29C3G?

The EP4SGX230DF29C3G combines a large programmable fabric with significant embedded memory and a high I/O count, making it suitable for designs that demand integrated data-path processing and flexible interfacing. Its features are aligned with the Stratix IV family documentation, providing a clear reference for architecture-level planning.

This commercial-grade FPGA is appropriate for engineering teams building networking, DSP and system-integration products that benefit from scalable logic capacity, on-chip memory and a documented architecture roadmap.

If you would like pricing, availability, or to request a formal quote for EP4SGX230DF29C3G, submit an inquiry or request a quote through your procurement channel. A sales or support contact can provide ordering and lead-time information.