EP4SGX230DF29C4G
| Part Description |
Field Programmable Gate Array (FPGA) IC |
|---|---|
| Quantity | 350 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 780-FBGA (29x29) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 780-BBGA, FCBGA | Number of I/O | 372 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 9120 | Number of Logic Elements/Cells | 228000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 17544192 |
Overview of EP4SGX230DF29C4G – Field Programmable Gate Array (FPGA) IC
The EP4SGX230DF29C4G is a Stratix IV–family FPGA offering a high density programmable fabric targeted at demanding digital designs. It delivers a large logic resource pool, significant embedded memory, and rich I/O capability for high-bandwidth system integration and signal-processing applications.
Designed for commercial-grade applications, this surface-mount FCBGA device provides on-chip memory and transceiver-capable architecture features suitable for designs requiring substantial logic, memory, and I/O integration while operating within standard commercial temperature and core-voltage ranges.
Key Features
- Core Logic — 228,000 logic elements available for implementing complex custom logic, state machines, and data-paths.
- Embedded Memory — Approximately 17.5 Mbits of on-chip RAM to support buffering, queues, and local data storage for high-throughput designs.
- I/O Capacity — 372 user I/O pins to connect to external peripherals, memory interfaces, and high-speed front-end devices.
- Stratix IV Architecture — Built on Stratix IV device family technology with documented features including high-speed transceivers, DSP blocks, clock networks, and PLL resources suitable for bandwidth-intensive applications.
- Power Supply — Core supply range specified at 870 mV to 930 mV to match platform power-rail requirements.
- Package & Mounting — 780-FBGA (29×29) FCBGA package, surface-mount mounting type for compact board integration.
- Commercial Temperature Grade — Rated for operation from 0 °C to 85 °C, suitable for commercial-environment deployments.
- Compliance — RoHS-compliant manufacturing.
Typical Applications
- High-bandwidth communications — Implement protocol engines and high-speed interfaces leveraging Stratix IV transceiver and I/O capability for data aggregation and transport.
- Digital signal processing — Use the device’s logic density and embedded memory to implement DSP kernels and signal pipelines for real-time processing tasks.
- External memory interfaces — Serve as a bridge or controller for external memory systems, benefiting from the device family’s documented external memory interface features.
- System integration and prototyping — Integrate multiple functions (control, data path, I/O) into a single FPGA for proof-of-concept and production prototypes.
Unique Advantages
- High logic density: 228,000 logic elements enable complex designs to be implemented without partitioning across multiple devices, reducing board-level complexity.
- Significant on-chip memory: Approximately 17.5 Mbits of embedded RAM reduces dependence on external memory for intermediate buffering and state storage.
- Extensive I/O availability: 372 I/Os provide flexible connectivity for peripherals, memory, and high-speed I/O lanes, simplifying system integration.
- Family-level feature set: Stratix IV architecture support for transceivers, DSP blocks, PLLs, and robust clock networks enables bandwidth-oriented and timing-critical designs.
- Compact package: 780-FBGA (29×29) package allows dense PCB layouts and supports surface-mount assembly workflows.
- Commercial-ready: Rated for 0 °C to 85 °C and RoHS-compliant, suitable for a wide range of commercial electronic products.
Why Choose EP4SGX230DF29C4G?
The EP4SGX230DF29C4G provides a blend of large programmable logic capacity, substantial embedded memory, and a high I/O count in a compact FCBGA package. Its Stratix IV family architecture supports the types of transceiver, DSP, and clocking features required by high-throughput, latency-sensitive designs while operating within commercial voltage and temperature ranges.
This device is well suited for engineering teams building complex communication, signal-processing, and system-integration solutions that require on-chip resources to reduce external component count and maintain tight timing and bandwidth requirements. Its combination of density, memory, and I/O scalability supports longer-term design evolution within the same device family.
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