EP4SGX230DF29C4G

IC FPGA 372 I/O 780FBGA
Part Description

Field Programmable Gate Array (FPGA) IC

Quantity 350 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package780-FBGA (29x29)GradeCommercialOperating Temperature0°C – 85°C
Package / Case780-BBGA, FCBGANumber of I/O372Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs9120Number of Logic Elements/Cells228000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits17544192

Overview of EP4SGX230DF29C4G – Field Programmable Gate Array (FPGA) IC

The EP4SGX230DF29C4G is a Stratix IV–family FPGA offering a high density programmable fabric targeted at demanding digital designs. It delivers a large logic resource pool, significant embedded memory, and rich I/O capability for high-bandwidth system integration and signal-processing applications.

Designed for commercial-grade applications, this surface-mount FCBGA device provides on-chip memory and transceiver-capable architecture features suitable for designs requiring substantial logic, memory, and I/O integration while operating within standard commercial temperature and core-voltage ranges.

Key Features

  • Core Logic — 228,000 logic elements available for implementing complex custom logic, state machines, and data-paths.
  • Embedded Memory — Approximately 17.5 Mbits of on-chip RAM to support buffering, queues, and local data storage for high-throughput designs.
  • I/O Capacity — 372 user I/O pins to connect to external peripherals, memory interfaces, and high-speed front-end devices.
  • Stratix IV Architecture — Built on Stratix IV device family technology with documented features including high-speed transceivers, DSP blocks, clock networks, and PLL resources suitable for bandwidth-intensive applications.
  • Power Supply — Core supply range specified at 870 mV to 930 mV to match platform power-rail requirements.
  • Package & Mounting — 780-FBGA (29×29) FCBGA package, surface-mount mounting type for compact board integration.
  • Commercial Temperature Grade — Rated for operation from 0 °C to 85 °C, suitable for commercial-environment deployments.
  • Compliance — RoHS-compliant manufacturing.

Typical Applications

  • High-bandwidth communications — Implement protocol engines and high-speed interfaces leveraging Stratix IV transceiver and I/O capability for data aggregation and transport.
  • Digital signal processing — Use the device’s logic density and embedded memory to implement DSP kernels and signal pipelines for real-time processing tasks.
  • External memory interfaces — Serve as a bridge or controller for external memory systems, benefiting from the device family’s documented external memory interface features.
  • System integration and prototyping — Integrate multiple functions (control, data path, I/O) into a single FPGA for proof-of-concept and production prototypes.

Unique Advantages

  • High logic density: 228,000 logic elements enable complex designs to be implemented without partitioning across multiple devices, reducing board-level complexity.
  • Significant on-chip memory: Approximately 17.5 Mbits of embedded RAM reduces dependence on external memory for intermediate buffering and state storage.
  • Extensive I/O availability: 372 I/Os provide flexible connectivity for peripherals, memory, and high-speed I/O lanes, simplifying system integration.
  • Family-level feature set: Stratix IV architecture support for transceivers, DSP blocks, PLLs, and robust clock networks enables bandwidth-oriented and timing-critical designs.
  • Compact package: 780-FBGA (29×29) package allows dense PCB layouts and supports surface-mount assembly workflows.
  • Commercial-ready: Rated for 0 °C to 85 °C and RoHS-compliant, suitable for a wide range of commercial electronic products.

Why Choose EP4SGX230DF29C4G?

The EP4SGX230DF29C4G provides a blend of large programmable logic capacity, substantial embedded memory, and a high I/O count in a compact FCBGA package. Its Stratix IV family architecture supports the types of transceiver, DSP, and clocking features required by high-throughput, latency-sensitive designs while operating within commercial voltage and temperature ranges.

This device is well suited for engineering teams building complex communication, signal-processing, and system-integration solutions that require on-chip resources to reduce external component count and maintain tight timing and bandwidth requirements. Its combination of density, memory, and I/O scalability supports longer-term design evolution within the same device family.

Request a quote or submit a product inquiry to receive pricing and availability information for the EP4SGX230DF29C4G.

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