EP4SGX230DF29C3N

IC FPGA 372 I/O 780FBGA
Part Description

Stratix® IV GX Field Programmable Gate Array (FPGA) IC 372 17544192 228000 780-BBGA, FCBGA

Quantity 251 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package780-FBGA (29x29)GradeCommercialOperating Temperature0°C – 85°C
Package / Case780-BBGA, FCBGANumber of I/O372Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs9120Number of Logic Elements/Cells228000
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits17544192

Overview of EP4SGX230DF29C3N – Stratix® IV GX Field Programmable Gate Array (FPGA), 228000 logic elements

The EP4SGX230DF29C3N is an Intel Stratix IV GX FPGA featuring a high-capacity fabric and architecture elements targeted at high-throughput, protocol-rich designs. This device combines 228,000 logic elements with substantial on‑chip RAM and a large I/O complement to support complex system integration.

Documented as part of the Stratix IV family, the device handbook highlights core FPGA fabric features such as high-speed transceiver support, embedded memory, DSP blocks, clock networks and PLLs—making this part suitable for designs that require high aggregate data bandwidth and extensive I/O integration.

Key Features

  • Logic Capacity  Provides 228,000 logic elements for implementing large-scale digital designs and complex algorithms.
  • Embedded Memory  Approximately 17.5 Mbits of on-chip RAM (17,544,192 total RAM bits) to support buffering, lookup tables and local storage.
  • I/O Density  372 I/O pins enable broad interfacing options for external peripherals, memory and high-density board designs.
  • Stratix IV GX Architecture  Device handbook entries describe Stratix IV GX family features including high-speed transceiver capabilities and wide protocol support.
  • DSP and Timing Resources  The device family documentation lists digital signal processing (DSP) blocks, clock networks and PLLs to support deterministic timing and signal-processing workloads.
  • Power Supply  Core supply specified between 870 mV and 930 mV, enabling designers to plan for the device’s core voltage requirements.
  • Package & Mounting  780‑FBGA (29×29) surface‑mount package (listed as 780‑BBGA, FCBGA) for compact board-level integration.
  • Operating Range  Commercial grade operation from 0 °C to 85 °C.
  • Regulatory  RoHS‑compliant.

Typical Applications

  • High‑bandwidth communications  Where high aggregate data bandwidth and protocol support are required, the Stratix IV GX architecture and transceiver features provide the necessary foundation.
  • Signal processing and DSP  Large logic capacity and documented DSP block support make the device suitable for compute‑intensive signal-processing pipelines.
  • High‑pin count system integration  With 372 I/Os and an FCBGA package, the device supports dense external memory and peripheral interfaces on compact PCBs.
  • External memory interfaces  The device family explicitly addresses external memory interface support, useful for designs requiring extended buffering or high-throughput memory access.

Unique Advantages

  • High logic density: 228,000 logic elements enable large designs or multiple concurrent functions on a single device.
  • Significant on‑chip RAM: Approximately 17.5 Mbits of embedded memory reduces dependence on external RAM for many buffering and storage needs.
  • Large I/O complement: 372 I/Os support complex board-level connectivity and multiple peripheral interfaces without external multiplexing.
  • Family features documented in device handbook: Stratix IV GX family details include high-speed transceivers, DSP blocks, PLLs and clock networks—providing design resources for high-performance systems.
  • Compact surface‑mount package: 780‑FBGA (29×29) package offers a high I/O density footprint for space-constrained applications.
  • Commercial operating range and RoHS compliance: Supports standard commercial temperature operation (0 °C to 85 °C) and meets RoHS requirements for environmental compliance.

Why Choose EP4SGX230DF29C3N?

The EP4SGX230DF29C3N positions itself for projects that require substantial logic resources, sizeable embedded memory and a high number of I/Os in a compact FCBGA package. Backed by the Stratix IV GX device family documentation, the part provides architectural building blocks—such as transceiver support, DSP resources and robust clocking—that engineers can leverage for high-throughput, protocol-rich systems.

This device is well suited to design teams building complex communications, signal-processing or high-integration systems who need a commercially graded FPGA with verifiable specifications for core voltage, operating temperature and on-chip resource counts.

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