EP4SGX230DF29C3

The EP4SGX230DF29C3 is a Stratix® IV GX field programmable gate array (FPGA) in a 780-ball FCBGA package. It integrates a large FPGA fabric with high-speed transceiver and I/O capabilities targeted at high-bandwidth data processing and communications applications.

With 228,000 logic elements, approximately 17.5 Mbits of embedded memory, and 372 I/O pins, this commercial-grade device is designed to deliver extensive on-chip resources and flexible system integration for demanding designs that require significant logic density and on-chip RAM.

Key Features

• Core Logic  Provides 228,000 logic elements for complex digital designs and large-scale integration.
• Embedded Memory  Approximately 17.5 Mbits of on-chip RAM to support buffers, packet processing, and local storage.
• I/O Density  372 I/O pins enable extensive external device interfacing and high channel counts for system connectivity.
• High-Speed Transceiver and Architecture Features  Stratix IV GX family features such as high-speed transceivers, external memory interface support, DSP blocks, and clocking/PLL resources are included in the device handbook and underpin high-bandwidth and protocol-flexible designs.
• Package  780-ball BGA (FCBGA), supplier package 780-FBGA (29×29), for compact, high-density board implementations.
• Power  Core supply specified at 870 mV to 930 mV, allowing precise power budgeting in multi-rail systems.
• Operating Range  Commercial operating temperature range of 0 °C to 85 °C.
• Compliance  RoHS compliant.

Typical Applications

• High‑Speed Data Processing  Use the large logic capacity and embedded memory to implement packet processing, aggregation, or other throughput‑intensive algorithms on-chip.
• Communications and Networking  Leverage the Stratix IV GX architecture and high-speed transceiver features to implement protocol interfaces, bridging, and transport functions.
• External Memory Interfaces  Deploy as a memory controller or interface engine using the device’s external memory interface support and on-chip RAM.
• DSP‑Oriented Workloads  Apply the device’s DSP and fabric resources to signal processing pipelines that require on-chip arithmetic and local buffering.

Unique Advantages

• High logic density: 228,000 logic elements allow consolidation of multiple functions into a single FPGA, reducing board-level component count.
• Substantial embedded RAM: Approximately 17.5 Mbits of on-chip memory supports large buffers and reduces dependence on external memory for intermediate storage.
• Extensive I/O capability: 372 I/O pins provide flexibility for multi-channel designs and high connector counts without additional multiplexing logic.
• Compact, manufacturable package: 780-BBGA (29×29 FCBGA) enables high-density PCB layouts suitable for space-constrained systems.
• Precise power specification: Narrow core voltage range (870 mV–930 mV) simplifies power-rail design and margining for the FPGA core.
• Vendor documentation and family features: Stratix IV GX family attributes documented in the device handbook—such as high-speed transceivers, PLLs, and clock networks—support scalable high‑performance designs.

Why Choose EP4SGX230DF29C3?

The EP4SGX230DF29C3 combines high logic capacity, significant embedded memory, and a dense I/O complement in a compact FCBGA package, making it well suited to systems that require on-chip integration of complex logic, buffering, and high‑speed interfaces. Its Stratix IV GX family features—documented in the device handbook—provide architectural building blocks for high-bandwidth, protocol-flexible implementations.

This device is targeted at engineers designing communications, networking, and data processing equipment who need a commercially graded FPGA with a defined operating temperature range, precise core voltage requirements, and RoHS compliance for modern manufacturing flows.

Request a quote or submit your design requirements to receive pricing and availability information for the EP4SGX230DF29C3.