EP4SGX230DF29I3N

IC FPGA 372 I/O 780FBGA
Part Description

Stratix® IV GX Field Programmable Gate Array (FPGA) IC 372 17544192 228000 780-BBGA, FCBGA

Quantity 571 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package780-FBGA (29x29)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case780-BBGA, FCBGANumber of I/O372Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs9120Number of Logic Elements/Cells228000
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits17544192

Overview of EP4SGX230DF29I3N – Stratix® IV GX FPGA, 780-BBGA FCBGA

The EP4SGX230DF29I3N is a Stratix IV GX field-programmable gate array (FPGA) offered in a 780-ball FCBGA package. It implements the Stratix IV architecture with features called out in the device handbook, including high-speed transceiver support, DSP resources, PLLs, and extensive clock and I/O capabilities.

With approximately 228,000 logic elements and roughly 17.54 Mbits of embedded memory, this industrial-grade FPGA targets high-bandwidth digital designs that require dense logic, significant on-chip RAM, and a broad I/O complement while operating across a wide industrial temperature range.

Key Features

  • Core Capacity — Approximately 228,000 logic elements (9120 logic blocks reported), providing large-scale programmable logic for complex digital designs.
  • Embedded Memory — Approximately 17.54 Mbits of on-chip RAM to support buffering, packet processing, and local data storage without immediate external memory dependence.
  • I/O Resources — 372 I/O pins to support extensive parallel interfaces and multiple external peripherals or memory buses.
  • High-Speed Architecture — Stratix IV GX family features listed in the device handbook include high-speed transceiver support, diagnostics, and wide protocol support for high aggregate data bandwidth.
  • DSP and Clocking — Family-level references to digital signal processing (DSP) blocks and multiple PLL/clock-network resources aid in implementing signal processing and timing-critical functions.
  • Power and Voltage — Core voltage supply range specified from 870 mV to 930 mV for the device core domain.
  • Package & Mounting — 780-BBGA (FCBGA) 29×29 supplier package designed for surface-mount assembly.
  • Operating Range & Grade — Industrial grade operation with an ambient range of −40 °C to 100 °C; RoHS-compliant.

Typical Applications

  • High-Bandwidth Communications — Use the Stratix IV GX architecture and high-speed transceiver feature set for protocol implementation and aggregate data transport.
  • Signal Processing and DSP — Large logic capacity and on-chip RAM support DSP pipelines, filtering, and real-time data manipulation.
  • External Memory Interfaces — Ample I/O count and family-level external memory interface support enable implementation of wide memory buses and buffering schemes.

Unique Advantages

  • High Logic Density: Approximately 228,000 logic elements enable integration of complex state machines, custom processors, and large programmable systems on a single device.
  • Substantial Embedded Memory: Approximately 17.54 Mbits of on-chip RAM reduces reliance on external memory for many buffering and caching needs, simplifying BOM and board layout.
  • Extensive I/O Count: 372 I/O pins provide flexibility for multi-lane interfaces, parallel peripherals, and memory expansions without immediate external I/O expanders.
  • Industrial Temperature Rating: Rated for −40 °C to 100 °C operation to meet demanding environmental requirements for industrial deployments.
  • Stratix IV GX Family Capabilities: Device-level access to high-speed transceiver features, DSP blocks, PLLs, and advanced clock networks as described in the device handbook supports complex, high-throughput designs.
  • RoHS Compliance: Environmentally compliant lead-free package suitable for modern assembly processes.

Why Choose EP4SGX230DF29I3N?

The EP4SGX230DF29I3N positions itself as a high-capacity Stratix IV GX FPGA option for engineers needing substantial logic resources, embedded memory, and a large I/O complement within an industrial temperature envelope. Its family-level architecture emphasizes high aggregate bandwidth, transceiver capabilities, and DSP support, making it suitable for demanding communications and signal-processing designs.

Choose this device when your design requires scalable programmable logic, integrated memory for on-chip data handling, and robust I/O in a surface-mount 780-BBGA package with industrial-grade operating range and RoHS compliance.

Request a quote or submit a procurement inquiry for EP4SGX230DF29I3N to get pricing and availability information for your design requirements.

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