EP4SGX230DF29I4

The EP4SGX230DF29I4 is a Stratix® IV GX field programmable gate array (FPGA) IC from Intel, delivering a high-density programmable fabric for complex digital designs. It combines a large logic element count with substantial on-chip RAM and extensive I/O to support demanding system integration tasks.

This industrial-grade device is targeted at applications that require significant logic capacity, high I/O counts, and reliable operation across a wide temperature range. Key value propositions include high logic density, approximately 17.5 Mbits of embedded memory, and support for high-speed transceiver and system integration features as documented in the Stratix IV device handbook.

Key Features

• Logic Capacity — 228,000 logic elements to implement complex custom logic, protocol processing, and high-density control functions.
• Embedded Memory — Approximately 17.5 Mbits of on-chip RAM to support buffering, packet processing, and embedded data storage without external memory in many use cases.
• I/O Density — 372 user I/O pins to connect to external peripherals, memory interfaces, and high-speed I/O channels.
• High-Speed Transceiver and Architecture Features — As a Stratix IV GX device, the datasheet describes high-speed transceiver features, DSP blocks, PLLs, and external memory interface support for bandwidth- and protocol-focused designs.
• Power and Voltage — Core voltage supply range of 870 mV to 930 mV to match system power architectures and power delivery designs.
• Package and Mounting — 780-ball FCBGA package (29×29) in a surface-mount form factor for compact board-level integration.
• Industrial Temperature Grade — Rated for operation from −40 °C to 100 °C for use in thermally demanding environments.
• Regulatory Compliance — RoHS compliant.

Typical Applications

• High-speed serial communications — Leverage Stratix IV GX transceiver features and abundant logic to implement protocol bridges, line cards, and backplane links.
• Packet processing and networking — Use the high logic density and on-chip RAM for packet buffering, classification, and custom forwarding engines.
• Signal processing and DSP — Implement compute-intensive DSP pipelines using the device fabric and documented DSP resources in the Stratix IV family.
• Board-level system integration — The 372 I/O and FCBGA package support dense board interconnects and integration with external memory and peripherals.

Unique Advantages

• High logic density: 228,000 logic elements enable consolidation of multiple functions into a single device, reducing BOM and board complexity.
• Substantial on-chip memory: Approximately 17.5 Mbits of embedded RAM minimizes dependence on external memory for many buffering and storage tasks.
• Extensive I/O: 372 I/O pins provide flexibility for connecting to multiple interfaces and large external subsystems.
• Industrial operating range: −40 °C to 100 °C rating supports deployment in thermally challenging environments.
• Compact FCBGA package: 780-ball (29×29) FCBGA surface-mount package allows dense PCB routing and reliable mechanical mounting.
• Manufacturer-backed documentation: Device details and architecture features are documented in the Stratix IV device handbook provided by the manufacturer.

Why Choose EP4SGX230DF29I4?

The EP4SGX230DF29I4 is positioned for designs that demand high logic capacity, significant embedded memory, and large I/O counts in an industrial temperature package. Its combination of 228,000 logic elements, approximately 17.5 Mbits of on-chip RAM, and 372 I/O pins makes it suitable for complex networking, communication, and signal-processing applications where integration and board-level density matter.

For engineering teams and procurement professionals building scalable, high-performance systems, this Stratix IV GX FPGA delivers documented architecture features and the physical characteristics needed to integrate into robust, manufacturable designs.

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