EP4SGX230FF35C3

The EP4SGX230FF35C3 is a Stratix® IV GX field programmable gate array (FPGA) delivered in a 1152‑FBGA (35×35) package. It provides a high logic capacity and extensive I/O for applications that require dense programmable logic, on‑chip memory, and advanced I/O capabilities.

Built on the Stratix IV device family architecture, the device targets designs that benefit from high aggregate data bandwidth, embedded DSP and memory resources, and integrated high‑speed transceiver and I/O features as described in the device handbook.

Key Features

• Logic Capacity — 228,000 logic elements providing substantial programmable logic resources for complex designs.
• Embedded Memory — Approximately 17.5 Mbits of on‑chip RAM (17,544,192 total RAM bits) to support buffering, large state machines, and local data storage.
• I/O Density — 564 user I/O pins to enable broad peripheral connectivity and multiple high‑pin‑count interfaces.
• Package and Mounting — 1152‑FBGA package (35×35), supplied as a surface‑mount FCBGA/BBGA offering a compact, board‑level integration option.
• Power — Core supply range specified at 870 mV to 930 mV to match system power rails and regulator design.
• Operating Range — Commercial temperature grade rated from 0 °C to 85 °C for standard electronic applications.
• Series Capabilities (from device handbook) — Stratix IV GX family features include high‑speed transceiver support, DSP blocks, PLLs and clock networks, extensive I/O features, and diagnostic and signal‑integrity capabilities.
• Compliance — RoHS compliant, supporting lead‑free manufacturing processes.

Typical Applications

• High‑performance signal processing — Leverage the device’s large logic and embedded memory for DSP pipelines and algorithm acceleration.
• High‑bandwidth communications — Use the Stratix IV GX family’s high‑speed transceiver and I/O features to implement data‑plane and protocol processing functions.
• Complex system integration — Dense logic and 564 I/Os enable consolidation of multiple functions (control, interface bridging, custom peripherals) into a single FPGA.

Unique Advantages

• High logic density: 228,000 logic elements allow implementation of large state machines, custom processors, and parallel datapaths within a single device.
• Significant on‑chip memory: Approximately 17.5 Mbits of embedded RAM reduce external memory dependencies for many buffering and lookup requirements.
• Extensive I/O capability: 564 I/Os support multiple external interfaces and high‑pin‑count peripherals without adding external bridging components.
• Compact BGA packaging: 1152‑FBGA (35×35) offers a high‑pin‑count, surface‑mount footprint suitable for dense board layouts.
• Low‑voltage core operation: Core supply specified between 870 mV and 930 mV enables efficient power‑rail design and modern regulator use.
• RoHS compliant: Supports lead‑free assembly and aligns with common environmental directives.

Why Choose EP4SGX230FF35C3?

The EP4SGX230FF35C3 positions itself as a high‑capacity Stratix IV GX FPGA option for designs that require a combination of large programmable logic resources, substantial embedded memory, and a high I/O count in a compact BGA package. Its family‑level features—such as high‑speed transceiver support, DSP resources, and robust clocking and diagnostic capabilities—make it suitable for demanding communication and signal‑processing workloads.

This device is appropriate for engineering teams seeking scalable programmable logic with strong ecosystem and device‑handbook documented capabilities, along with commercial temperature operation and RoHS compliance for standard production environments.

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