EP4SGX230FF35C4

The EP4SGX230FF35C4 is a Stratix IV GX field programmable gate array (FPGA) in a 1152-ball FCBGA package, designed for high-density logic and heavy I/O integration. It implements the Stratix IV family architecture and is suited to designs that require large logic capacity, substantial on-chip memory, and a high number of I/O pins.

This device targets applications that demand significant programmable logic and embedded memory within a commercial temperature range, offering a balance of integration and performance for communications, signal processing, and high-throughput system designs.

Key Features

• Logic Capacity — 228,000 logic elements providing a high-density programmable fabric for complex FPGA designs.
• Embedded Memory — Approximately 17.5 Mbits of on-chip RAM, useful for buffering, FIFOs, and memory-intensive logic functions.
• I/O Density — 564 I/O pins to support wide parallel interfaces, multi-channel connectivity, or extensive sensor and peripheral arrays.
• Package & Mounting — 1152-ball FCBGA (35 × 35) package in a surface-mount form factor for high‑density board implementations.
• Power Supply — Core voltage range specified at 0.87 V to 0.93 V, enabling designs that match the device’s low-voltage core requirements.
• Operating Temperature & Grade — Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Stratix IV Family Features — Device handbook entries reference architecture-level capabilities including high-speed transceiver features, PLLs, clock networks, embedded memory, and DSP blocks relevant to the Stratix IV family.

Typical Applications

• High‑speed communications and networking — Leverage the Stratix IV GX family’s high-speed transceiver features and high logic/I/O density for packet processing, protocol handling, and line-card functions.
• Signal processing and DSP — Use the device’s large logic capacity and embedded memory for high-throughput digital signal processing and multi-channel data paths.
• Video and imaging systems — Large on-chip RAM and abundant I/O support frame buffering, parallel video interfaces, and real-time image processing pipelines.
• Memory interface and bridging — Support external memory interfaces and wide I/O counts for memory controller implementations and high-bandwidth data movement.

Unique Advantages

• High logic density: 228,000 logic elements enable complex control, datapath, and state-machine implementations without immediate design partitioning.
• Substantial embedded memory: Approximately 17.5 Mbits of on-chip RAM reduces external memory dependence for buffering and local storage.
• Broad I/O support: 564 I/O pins accommodate parallel interfaces and multi-channel connectivity, simplifying board-level integration.
• Compact, high-density package: 1152-ball FCBGA (35 × 35) surface-mount package supports a dense PCB layout while providing the pin count required for complex systems.
• Commercial temperature and voltage specifications: Rated for 0 °C to 85 °C and a core supply of 0.87–0.93 V, allowing straightforward compatibility with standard commercial system rails.
• Stratix IV family capabilities: Family-level features such as PLLs, clock networks, DSP blocks, and high-speed transceiver functionality provide architectural building blocks for advanced designs.

Why Choose EP4SGX230FF35C4?

The EP4SGX230FF35C4 combines large logic capacity, significant embedded memory, and an extensive I/O complement in a single commercial-grade FCBGA package. Its specification set aligns with demanding systems that require dense programmable logic, on-chip buffering, and broad external connectivity.

This device is well suited to designers building high-throughput communications, signal processing, video, or memory-interface applications who need a scalable FPGA platform within the Stratix IV family and prefer a high-density package for compact, performance-oriented boards.

If you require pricing, availability, or a tailored quotation for EP4SGX230FF35C4, please request a quote or submit an inquiry to our sales team to start the procurement process.