EP4SGX230FF35C3N

The EP4SGX230FF35C3N is a Stratix® IV GX Field Programmable Gate Array (FPGA) from Intel designed for commercial-grade applications requiring large programmable logic capacity and extensive I/O. This device combines 228,000 logic elements with substantial on-chip memory and a high-pin-count BGA package to support complex digital designs.

With a low-voltage core supply range and surface-mount FCBGA packaging, the EP4SGX230FF35C3N is targeted at system designs that require dense integration of programmable logic, embedded memory, and broad I/O connectivity within a compact footprint.

Key Features

• Core Logic  228,000 logic elements provide large-scale programmable logic capacity for complex custom functions and intensive parallel processing.
• Embedded Memory  Approximately 17.5 Mbits of on-chip RAM to support data buffering, lookup tables, and state storage within designs.
• I/O Density  564 I/O pins to enable extensive external connectivity for multi-channel interfaces and high pin-count system integrations.
• Power and Voltage  Core supply voltage range of 870 mV to 930 mV to match low-voltage system architectures.
• Package & Mounting  1152-BBGA (FCBGA) package, supplier device package 1152-FBGA (35×35), optimized for surface-mount assembly and compact board designs.
• Operating Conditions  Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Regulatory Compliance  RoHS compliant for lead-free manufacturing and environmental compatibility.

Typical Applications

• High-density programmable systems  Suited for designs that require a large number of logic elements and significant on-chip memory in a single FPGA device.
• Multi-channel I/O platforms  Ideal for systems needing extensive external interfacing or multiple parallel data paths thanks to 564 I/O pins.
• Embedded digital processing  Useful where on-chip RAM and programmable logic are needed to implement custom data handling, buffering, or control logic.

Unique Advantages

• High logic capacity: 228,000 logic elements enable complex custom logic and parallel processing capability without immediate need for additional devices.
• Substantial embedded memory: Approximately 17.5 Mbits of on-chip RAM reduces external memory dependencies and simplifies board-level design.
• Extensive I/O count: 564 I/O pins support high channel counts and flexible interfacing to peripherals and daughtercards.
• Compact, high-density package: 1152-BBGA (35×35) FCBGA package allows dense routing and space-efficient PCB layouts for commercial systems.
• Low-voltage core operation: 870 mV to 930 mV supply range supports integration with modern low-voltage power domains.
• RoHS compliant: Conforms to lead-free manufacturing requirements for environmental and regulatory alignment.

Why Choose EP4SGX230FF35C3N?

The EP4SGX230FF35C3N delivers a combination of high logic density, meaningful on-chip memory, and large I/O capacity in a surface-mount FCBGA package, making it a practical choice for commercial designs that require significant programmable resources in a compact form factor. Manufactured by Intel, it targets engineers and system designers who need scalable programmable logic and dense integration for advanced digital functions.

This FPGA is well suited to customers developing complex logic-heavy systems that benefit from embedded RAM and broad I/O while operating within standard commercial temperature ranges. Its package and power characteristics support compact board designs and low-voltage system architectures, providing long-term value through integration and reduced external component needs.

Request a quote or submit a pricing inquiry today to evaluate the EP4SGX230FF35C3N for your next commercial FPGA design.