EP4SGX230FF35I4G
| Part Description |
Field Programmable Gate Array (FPGA) IC |
|---|---|
| Quantity | 961 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FBGA (35x35) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA, FCBGA | Number of I/O | 564 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 9120 | Number of Logic Elements/Cells | 228000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 17544192 |
Overview of EP4SGX230FF35I4G – Field Programmable Gate Array (FPGA) IC
The EP4SGX230FF35I4G is an Intel Stratix IV GX family field-programmable gate array optimized for high-density, high-bandwidth system designs. It combines a large programmable fabric with substantial embedded memory, extensive I/O, and on-chip features documented in the Stratix IV device handbook.
This device targets applications requiring significant logic capacity, flexible high-speed interfaces, and industrial-grade operating range, delivering integration and platform-level capabilities for communications, signal processing, and system acceleration designs.
Key Features
- Logic Capacity 228,000 logic elements to implement complex custom logic, accelerators, and protocol stacks.
- Embedded Memory Approximately 17.5 Mbits of on-chip RAM for buffering, lookup tables, and on-chip data storage.
- I/O and Packaging 564 I/O pins and a 1152-FBGA (35 × 35) package; surface-mount mounting for board-level integration.
- Family and Architecture Stratix IV GX device family architecture with FPGA fabric, high-speed transceiver support, and device-level features listed in the Stratix IV device handbook.
- High-Speed Transceiver and Interface Support High-speed transceiver features and broad protocol support as described in the Stratix IV documentation, enabling multi-protocol connectivity and high aggregate data bandwidth.
- DSP and Clocking Includes DSP block and clocking resources (PLLs, clock networks) to support signal processing and synchronized system designs.
- Diagnostics and Signal Integrity Device-level diagnostic and signal-integrity features described in the Stratix IV handbook to assist validation and reliable operation.
- Power Core supply voltage range of 0.870 V to 0.930 V, reflecting the device’s specified operating supply window.
- Temperature and Grade Industrial grade with operating range from −40 °C to 100 °C for deployment in temperature-challenging environments.
- Compliance RoHS compliant.
Typical Applications
- High‑speed networking and communications Use the device’s high-speed transceiver capabilities and large logic fabric to implement protocol engines, line cards, and transport-layer processing.
- Real‑time signal processing DSP blocks, abundant logic, and on-chip RAM enable FIR/IIR filters, modulation/demodulation, and other real-time processing pipelines.
- Compute acceleration and custom logic offload Leverage 228,000 logic elements and embedded memory to accelerate compute kernels and offload tasks from CPUs.
- High‑performance memory interfaces Documented external memory interface support in the Stratix IV family makes this device suitable for designs requiring large buffering and fast memory access.
Unique Advantages
- Highly integrated compute fabric: A large logic element count and substantial embedded memory reduce dependency on external components and simplify board-level design.
- Broad I/O and package options: 564 I/Os in a 1152-FBGA package support dense connectivity and compact PCB layouts.
- Designed for high bandwidth: Stratix IV GX family features and high-speed transceiver support enable high aggregate data throughput for demanding interfaces.
- Industrial temperature capability: Rated from −40 °C to 100 °C for deployment in temperature-challenging environments where extended operating range is required.
- Power‑specified core range: Core supply specified between 0.870 V and 0.930 V to match modern low-voltage FPGA power domains.
- Documented platform and tooling: Backed by the Stratix IV device handbook and supporting documentation for design, integration, and validation.
Why Choose EP4SGX230FF35I4G?
EP4SGX230FF35I4G positions itself as a high-density, high-I/O Stratix IV GX FPGA option for engineers building bandwidth- or compute-intensive systems. Its combination of 228,000 logic elements, approximately 17.5 Mbits of embedded memory, extensive I/O, and family-level support for high-speed transceivers makes it well suited to communications, signal processing, and acceleration applications.
With industrial temperature grading, RoHS compliance, and detailed device documentation, this device supports robust product development and deployment where long-term availability and comprehensive design guidance are important.
Request a quote or submit an inquiry to receive pricing, availability, and assistance integrating EP4SGX230FF35I4G into your next design.

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