EP4SGX230HF35C2G

The EP4SGX230HF35C2G is a Field Programmable Gate Array (FPGA) IC from Intel, documented within the Stratix IV device family handbook. It delivers a large programmable fabric combined with high-speed I/O and transceiver capabilities described in the Stratix IV Device Handbook.

This device targets designs that require significant logic capacity, embedded memory, and wide I/O bandwidth — for example, high-speed communications, digital signal processing, and complex system integration where on-chip resources and I/O density matter.

Key Features

• Core Architecture  Part of the Stratix IV device family (Stratix IV GX devices referenced in the device handbook) with FPGA fabric and architecture features outlined in the Stratix IV Device Handbook.
• Logic Capacity  228,000 logic elements (logic cells) to implement large custom logic functions and complex state machines.
• Embedded Memory  Approximately 17.5 Mbits of embedded RAM (17,544,192 total RAM bits) for on-chip buffering, FIFOs, and data storage.
• I/O and High-Speed Transceivers  564 I/O pins and high-speed differential I/O/transceiver features described in the Stratix IV handbook support wide protocol and interface implementations.
• Package & Mounting  1152-BBGA / FCBGA package (supplier device package: 1152-FBGA, 35×35) in a surface-mount form factor for high-density board integration.
• Power Supply  Core supply range specified at 870 mV to 930 mV.
• Operating Range & Grade  Commercial grade device with an operating temperature range of 0 °C to 85 °C.
• Regulatory  RoHS compliant.

Typical Applications

• High-Speed Communications  FPGA fabric combined with high-speed transceiver features supports designs requiring high aggregate data bandwidth and protocol flexibility.
• Digital Signal Processing  Large logic capacity and embedded RAM enable DSP pipelines, real-time data manipulation, and algorithm acceleration referenced by the Stratix IV DSP features.
• External Memory Interfaces  On-chip resources and the device’s external memory interface capabilities make it suitable for controller and buffering roles in memory-rich systems.
• System Integration  High I/O count and a dense FBGA package facilitate integration of multiple peripherals and interfaces on a single FPGA-centric board design.

Unique Advantages

• High logic density: 228,000 logic elements provide headroom for complex designs and larger feature sets without external logic.
• Substantial on-chip memory: Approximately 17.5 Mbits of embedded RAM reduces dependence on external memory for temporary storage and buffering.
• Broad I/O capability: 564 I/O pins allow extensive peripheral connectivity and multiple simultaneous interfaces.
• High-speed connectivity support: Transceiver and high-speed differential I/O features in the Stratix IV handbook enable implementations requiring significant bandwidth.
• Compact, high-density package: 1152-FBGA (35×35) surface-mount package offers dense integration for space-constrained PCB designs.
• Commercial-grade reliability and compliance: Rated 0 °C to 85 °C and RoHS compliant for standard commercial applications.

Why Choose EP4SGX230HF35C2G?

The EP4SGX230HF35C2G combines a large programmable fabric, significant embedded memory, and extensive I/O to support complex, high-bandwidth designs. Its specification in the Stratix IV Device Handbook highlights architecture features, high-speed transceiver support, diagnostic and signal-integrity capabilities, and external memory interface options that align with demanding system-level requirements.

This Intel FPGA is well suited for design teams building high-performance communications, DSP, and system-integration applications who require a commercially graded, RoHS-compliant device with dense logic, memory resources, and I/O bandwidth.

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