EP4SGX230HF35C3

The EP4SGX230HF35C3 is a Stratix® IV GX family FPGA IC in a 1152-BBGA FCBGA package designed for high-density, programmable digital logic. It provides a large logic fabric, substantial on-chip memory, and a broad I/O count for complex system designs in commercial applications.

With 228,000 logic elements, approximately 17.5 Mbits of embedded RAM, and 564 I/Os, this device is intended for designs that require significant logic capacity, memory resources, and I/O connectivity while operating within a commercial temperature range.

Key Features

• Logic Capacity — 228,000 logic elements to implement complex digital functions and large-scale custom logic networks.
• Embedded Memory — Approximately 17.5 Mbits of on-chip RAM to support buffering, lookup tables, and data storage without immediate dependence on external memory.
• I/O Resources — 564 I/O pins for extensive peripheral and system interfacing options.
• Package and Mounting — 1152-BBGA (FCBGA) package, supplier device package 1152-FBGA (35×35), designed for surface-mount assembly.
• Power Supply — Core voltage operating range from 870 mV to 930 mV to meet specified power domains.
• Operating Range & Grade — Commercial grade device rated for 0 °C to 85 °C operation.
• Environmental Compliance — RoHS-compliant for regulated-substance requirements.

Typical Applications

• High-density digital logic — Use the 228,000 logic elements to implement complex state machines, custom datapaths, and protocol processing.
• Memory-intensive functions — Leverage approximately 17.5 Mbits of embedded RAM for buffering, packet memory, and local data storage.
• I/O-heavy systems — Employ 564 I/Os for extensive sensor, peripheral, or high-channel-count interface requirements.

Unique Advantages

• Substantial logic resources — Large logic element count enables integration of multiple functions into a single device, reducing external component count.
• Significant on-chip memory — Approximately 17.5 Mbits of RAM supports data buffering and intermediate storage directly on the FPGA fabric.
• High I/O density — 564 I/Os allow flexible connectivity for complex system interfaces and multiple peripherals.
• Industry-standard package — 1152-BBGA FCBGA footprint and surface-mount compatibility simplify board-level integration in compact layouts.
• Regulatory readiness — RoHS compliance supports environmentally regulated manufacturing requirements.

Why Choose EP4SGX230HF35C3?

The EP4SGX230HF35C3 combines high logic density, ample embedded memory, and extensive I/O in a commercial-grade Stratix® IV GX FPGA package. Its specification set is suited to engineers and procurement teams seeking a programmable device that consolidates complex digital functions while offering robust on-chip resources.

This FPGA is appropriate for commercial designs that require sizable logic and memory capacity, broad interfacing capability, and RoHS compliance. It offers a clear path for scalable designs that prioritize integration and board-level density.

Request a quote or submit a sales inquiry to evaluate EP4SGX230HF35C3 for your next design or procurement cycle.