EP4SGX230HF35C4G
| Part Description |
Field Programmable Gate Array (FPGA) IC |
|---|---|
| Quantity | 9 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FBGA (35x35) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA, FCBGA | Number of I/O | 564 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 9120 | Number of Logic Elements/Cells | 228000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 17544192 |
Overview of EP4SGX230HF35C4G – Field Programmable Gate Array (FPGA) IC
The EP4SGX230HF35C4G is an Intel Stratix IV family FPGA designed for complex digital designs requiring high logic density and extensive I/O. It implements a Stratix IV GX–class architecture and targets applications that need large programmable fabric, embedded memory, and comprehensive I/O connectivity.
With 228,000 logic elements, approximately 17.5 Mbits of embedded memory and 564 I/O pins in a 1152-ball FBG A package, this device is suited to system designs in communications, data processing, and other performance-oriented commercial applications where integration and on-chip resources reduce external component count.
Key Features
- Logic Capacity 228,000 logic elements provide substantial programmable fabric for complex control, processing, and interface functions.
- Embedded Memory Approximately 17.5 Mbits of on-chip RAM to support buffering, lookup tables, and localized data storage without extensive external memory.
- I/O Count 564 device I/O pins to support wide external interfacing and multiple parallel buses or high-pin-count peripherals.
- Family Architecture Stratix IV device family features—documented in the Stratix IV Device Handbook—include high-speed transceiver features, DSP blocks, PLLs, clock networks, and external memory interface support.
- Package & Mounting 1152-ball FCBGA (listed as 1152-BBGA/FCBGA) with supplier device package 1152-FBGA (35×35 mm); surface-mount mounting type for PCB assembly.
- Power Core voltage supply range specified at 870 mV to 930 mV to match system power-rail planning.
- Operating Range Commercial-grade operating temperature from 0 °C to 85 °C for typical commercial applications.
- Regulatory RoHS compliant.
Typical Applications
- High-speed communications Implement protocol engines, parallel packet processing, and interface bridging using abundant logic and I/O resources.
- Data acquisition and processing On-chip memory and DSP-oriented family features support buffering and real-time signal processing tasks.
- External memory interfacing Use the device to drive and manage external memory interfaces while leveraging embedded RAM for caching and control.
- Custom hardware acceleration Deploy large, application-specific datapaths and control logic within the FPGA fabric for compute offload and latency-sensitive functions.
Unique Advantages
- Large programmable fabric: 228,000 logic elements enable integration of complex state machines, datapaths, and control logic on a single device, reducing board-level component count.
- Significant on-chip memory: Approximately 17.5 Mbits of embedded RAM supports local buffering and lookup operations, minimizing external memory bandwidth and latency requirements.
- Extensive I/O capacity: 564 I/O pins provide flexibility for parallel interfaces, multi-channel connections, and high pin-count peripherals.
- Stratix IV family capabilities: Family features such as high-speed transceivers, DSP blocks, and robust clocking options (PLLs and clock networks) provide building blocks for high-throughput designs.
- Compact system integration: 1152-ball FCBGA/FBGA package in a 35×35 mm footprint enables dense board designs while supporting surface-mount assembly.
- Regulatory and supply considerations: RoHS compliance and documented operating ranges simplify environmental and procurement planning for commercial deployments.
Why Choose EP4SGX230HF35C4G?
The EP4SGX230HF35C4G combines high logic density, substantial on-chip memory, and broad I/O capability within the Stratix IV device family, making it suitable for commercial systems that demand integrated digital processing and interface flexibility. Its documented family features—covering transceiver functionality, DSP resources, and advanced clocking—support designs that require scalable on-chip resources and reduced BOM.
This FPGA is well suited to engineering teams building communications, data processing, and hardware-accelerated solutions that benefit from large programmable fabric, embedded RAM, and a high I/O count, while operating within commercial temperature and voltage envelopes.
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