EP4SGX230HF35I3N

The EP4SGX230HF35I3N is a Stratix IV GX series FPGA in a 1152-BBGA FCBGA package designed for industrial applications. It combines a large logic fabric with substantial on-chip RAM and a high pin count to support complex, I/O-intensive designs.

This device is suitable for system-level functions that require extensive logic resources, plentiful I/O, and wide operating temperature capability. Its architecture—part of the Stratix IV family—includes series-level features such as embedded memory, DSP blocks, clock networks, PLLs, and high-speed transceiver capabilities described in the device handbook.

Key Features

• Large logic capacity — 228,000 logic elements to implement complex digital logic and control functions.
• Embedded memory — approximately 17.5 Mbits of on-chip RAM to support buffering, packet handling, and local data storage.
• Generous I/O — 564 I/O pins for broad external device and system connectivity needs.
• Industrial temperature range — specified operation from –40 °C to 100 °C for demanding thermal environments.
• Low-voltage core supply — core voltage specified between 870 mV and 930 mV for the device power domain.
• Package and mounting — 1152-BBGA (35×35) FCBGA surface-mount package providing high ball-count integration for dense board designs.
• Series-level architecture — Stratix IV GX family features referenced in the device handbook include embedded DSP blocks, clock networks, PLLs, external memory interface support, and high-speed transceiver capabilities.
• Regulatory — RoHS compliant for environmental and manufacturing requirements.

Typical Applications

• High-density logic systems — implement wide datapaths, custom accelerators, and large control state machines using extensive logic and embedded RAM.
• Communications and networking — use the device’s high I/O count and series-level transceiver features to manage protocol interfaces and data routing tasks.
• Signal processing and DSP — leverage embedded memory and the Stratix IV family’s DSP-oriented architecture to build filtering, FFT, and real-time processing blocks.
• Prototyping and system integration — ideal for complex FPGA-based prototypes or integration points where high I/O and significant logic resources are needed.

Unique Advantages

• High integration density: 228,000 logic elements and approximately 17.5 Mbits of embedded memory reduce the need for external logic and RAM, simplifying BOM and board routing.
• Broad external connectivity: 564 I/O pins enable multiple interfaces and parallel channels without extensive external multiplexing.
• Industrial-ready thermal range: –40 °C to 100 °C operation supports deployment in industrial environments with wide temperature swings.
• Compact, high-ball-count package: the 1152-BBGA FCBGA (35×35) package delivers dense pin routing and stable mechanical integration for surface-mount assembly.
• Low-voltage core: specified 870–930 mV core supply supports designs targeting modern power architectures and careful power budgeting.
• Standards-aware design base: device handbook coverage for Stratix IV GX family features (transceivers, PLLs, DSP blocks, clock networks) provides a documented architecture for system-level planning.

Why Choose EP4SGX230HF35I3N?

The EP4SGX230HF35I3N positions itself as a high-capacity, industrial-grade FPGA for designers who need large logic resources, substantial embedded memory, and a high I/O count in a single package. Its specification set is focused on system designs that demand integration, deterministic thermal performance, and flexible interfacing.

This device is suitable for engineering teams developing communications equipment, signal processing subsystems, high-density control logic, and system prototypes that require a documented Stratix IV GX architecture and RoHS-compliant manufacturing. The combination of logic, memory, I/O, and package density offers a scalable platform for medium- to high-complexity FPGA implementations.

Request a quote or submit a procurement inquiry to receive pricing and availability for the EP4SGX230HF35I3N. Our team can provide ordering information and help evaluate the device for your design requirements.