EP4SGX230HF35I4

The EP4SGX230HF35I4 is a Stratix® IV GX Field Programmable Gate Array (FPGA) in an industrial-grade, surface-mount FCBGA package. It combines high logic capacity, substantial embedded memory, and a large I/O count to address complex, I/O‑dense FPGA designs.

This device is suited for designs that require extensive programmable logic, significant on-chip RAM, and robust operating conditions, with supply and temperature ranges that support industrial deployments.

Key Features

• Core Logic 228,000 logic elements provide a large programmable fabric for implementing complex digital functions and custom logic architectures.
• Configurable Blocks 9,120 configurable blocks support structured implementation of logic and routing resources.
• Embedded Memory Approximately 17.5 Mbits of on-chip RAM enables local buffering, large lookup tables, and memory‑intensive algorithms without external memory for some functions.
• I/O Capability 564 device I/O pins accommodate high‑density peripheral interfacing and multi-channel connectivity in system designs.
• Package and Mounting 1152-BBGA (FCBGA) / 1152-FBGA (35 × 35) package in a surface-mount configuration eases board-level integration for compact, high‑pin‑count layouts.
• Supply and Temperature Supported supply range of 870 mV to 930 mV and an operating temperature range of –40°C to 100°C for industrial-temperature operation.
• Compliance RoHS compliant.

Typical Applications

• High-density digital systems — Implement large-scale logic functions and custom datapaths using 228,000 logic elements and extensive on-chip RAM.
• I/O‑intensive platforms — Support multi‑channel interfacing and complex peripheral arrays with 564 device I/Os.
• Industrial control and automation — Leverage the industrial temperature range (–40°C to 100°C) and surface-mount FCBGA packaging for reliable integration into industrial hardware.

Unique Advantages

• High logic capacity: 228,000 logic elements enable implementation of complex algorithms and large custom logic blocks without immediate partitioning across multiple devices.
• Substantial embedded memory: Approximately 17.5 Mbits of on-chip RAM reduces dependence on external memory for buffering and lookup storage, simplifying BOM and board layout for many applications.
• Large I/O complement: 564 I/O pins provide flexibility for dense peripheral connections, signal routing, and multi‑lane interfaces.
• Industrial temperature range: Rated for –40°C to 100°C operation to meet demanding environmental requirements in industrial deployments.
• Compact high‑pin package: 1152‑BBGA / 1152‑FBGA (35 × 35) package delivers a high pin count in a compact footprint suitable for space-constrained boards.
• RoHS compliant: Meets environmental requirements for lead‑free manufacturing processes.

Why Choose EP4SGX230HF35I4?

The EP4SGX230HF35I4 positions itself as a high-capacity, industrial-grade FPGA option for designs that demand extensive programmable logic, significant embedded RAM, and a large number of I/Os in a compact BGA package. Its supply range and wide operating temperature band make it appropriate for robust applications where environmental tolerance and integration density matter.

This device is a fit for engineering teams developing complex digital systems, I/O‑dense platforms, and industrial equipment that require scalable logic resources, on‑chip memory, and board-level integration flexibility.

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