EP4SGX230HF35I4G
| Part Description |
Field Programmable Gate Array (FPGA) IC |
|---|---|
| Quantity | 442 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FBGA (35x35) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA, FCBGA | Number of I/O | 564 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 9120 | Number of Logic Elements/Cells | 228000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 17544192 |
Overview of EP4SGX230HF35I4G – Field Programmable Gate Array (FPGA) IC
The EP4SGX230HF35I4G is an Intel Stratix IV family FPGA offering a high-density programmable fabric for complex digital designs. It combines a large logic capacity, substantial embedded memory, and extensive I/O to support demanding data, signal-processing, and system-integration tasks.
Designed for industrial environments, the device provides a wide operating temperature range and a low-voltage core supply window, delivering a balance of performance, integration, and environmental robustness for industrial and infrastructure applications.
Key Features
- Logic Fabric — 228,000 logic elements provide substantial programmable resources for large-scale designs and complex algorithms.
- Embedded Memory — Approximately 17.5 Mbits of on-chip RAM (17,544,192 total RAM bits) to support buffering, state storage, and data processing close to logic.
- I/O Density — 564 user I/O pins enable broad peripheral connectivity, parallel interfaces, and dense board-level integration.
- Stratix IV Architecture Features — The Stratix IV device family includes architecture elements such as DSP blocks, PLLs, and high-speed transceiver features as documented in the device handbook, enabling advanced signal processing and clock management.
- Package and Mounting — Supplied in a 1152-ball FCBGA package (1152-FBGA, 35×35), optimized for surface-mount assembly and compact board layouts.
- Power and Voltage — Core supply range specified at 870 mV to 930 mV for precise power budgeting and supply design.
- Industrial Temperature Grade — Rated for operation from −40 °C to 100 °C to meet industrial environmental requirements.
- Regulatory — RoHS compliant.
Typical Applications
- High‑throughput Networking — Large logic capacity and abundant I/O make the device suitable for packet processing, switching fabric, and other high-bandwidth communications functions.
- Signal Processing and Acceleration — Substantial embedded memory and Stratix IV DSP architecture elements support real-time data filtering, FFTs, and algorithm acceleration.
- Industrial Automation and Control — Industrial temperature rating and extensive I/O allow deployment in factory automation, motion control, and process-control systems.
- System Integration and Prototyping — High logic density and many I/Os enable system architects to combine multiple functions on a single FPGA for rapid prototyping and consolidated designs.
Unique Advantages
- High-density programmable fabric: 228,000 logic elements accommodate complex state machines, datapaths, and control logic within a single device.
- Substantial on-chip RAM: Approximately 17.5 Mbits of embedded memory reduces external memory dependence and lowers system latency for buffering and data staging.
- Extensive I/O count: 564 I/Os provide flexibility for parallel interfaces, multiple peripherals, and high-pin-count systems without excessive board complexity.
- Industrial robustness: −40 °C to 100 °C operating range supports deployment in harsh industrial environments.
- Compact FCBGA package: 1152-ball 35×35 FCBGA enables high integration density in space-constrained systems while supporting surface-mount assembly.
- Standards-aware family features: Stratix IV family architecture includes high-speed transceiver capabilities, DSP blocks, and PLLs (as documented in the device handbook), enabling advanced timing, clocking, and serial interface architectures.
Why Choose EP4SGX230HF35I4G?
EP4SGX230HF35I4G positions itself as a high-capacity, industrial-grade FPGA for designs that require significant logic resources, embedded memory, and broad I/O. Its Stratix IV family architecture provides the building blocks for advanced signal processing, clock management, and high-speed interfaces while the FCBGA package and surface-mount mounting support compact board designs.
This device is well suited to engineers and system designers working on industrial automation, networking infrastructure, and complex embedded systems who need scalable programmable resources, robust temperature performance, and a compact, high‑pin-count package backed by Intel’s Stratix IV documentation and design guidance.
Request a quote or submit an inquiry to learn about availability, pricing, and lead times for EP4SGX230HF35I4G. Our team can provide technical details and support to help you evaluate this FPGA for your design.

Date Founded: 1968
Headquarters: Santa Clara, California, USA
Employees: 130,000+
Revenue: $54.23 Billion
Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018