EP4SGX230HF35C3N

The EP4SGX230HF35C3N is a Stratix® IV GX Field Programmable Gate Array (FPGA) IC from Intel, offered in a 1152-BBGA FCBGA package. It delivers a high-capacity programmable logic fabric with substantial embedded RAM and a large I/O complement for dense system integration.

With 228,000 logic elements, approximately 17.5 Mbits of on-chip RAM and 564 user I/Os, this device is suited to designs that require significant logic resources, extensive on-chip memory, and high I/O density while operating within a commercial temperature range and a core supply window of 870 mV to 930 mV.

Key Features

• Core Logic  228,000 logic elements provide a high-capacity programmable fabric for complex digital designs.
• Embedded Memory  Approximately 17.5 Mbits of on-chip RAM to support buffering, lookup tables and state storage close to logic.
• I/O Density  564 user I/Os to enable extensive peripheral and interface connectivity within a single device.
• Package & Mounting  1152-BBGA, FCBGA (supplier package: 1152-FBGA, 35×35) in a surface-mount form factor for compact board integration.
• Power  Core voltage range specified at 870 mV to 930 mV to align with board power-rail planning.
• Operating Range & Grade  Commercial grade operation from 0 °C to 85 °C for standard ambient deployment.
• Environmental Compliance  RoHS compliant to meet common lead-free assembly requirements.

Typical Applications

• High-density logic systems  Use the 228,000 logic elements to implement complex state machines, datapaths and custom processors.
• Interface aggregation and prototyping  Leverage 564 I/Os to consolidate multiple interfaces and accelerate hardware development and system proof-of-concept.
• On-chip buffering and memory-intensive functions  Utilize approximately 17.5 Mbits of embedded RAM for packet buffering, FIFOs and local data storage to reduce external memory dependence.
• Compact board integration  The 1152-BBGA FCBGA package and surface-mount mounting enable dense PCB layouts for space-constrained systems.

Unique Advantages

• High logic capacity: 228,000 logic elements let you map large designs into a single device, reducing system complexity.
• Substantial embedded memory: Approximately 17.5 Mbits of on-chip RAM provides local storage for latency-sensitive functions and reduces external memory traffic.
• Extensive I/O count: 564 I/Os support broad connectivity for multi-channel interfaces and mixed-signal front-ends.
• Compact FCBGA packaging: 1152-BBGA (35×35) package supports dense board integration while maintaining a high pin count.
• Commercial temperature readiness: Rated 0 °C to 85 °C for typical commercial deployments without the need for industrial-grade selection.
• RoHS compliance: Meets lead-free assembly requirements for modern manufacturing processes.

Why Choose EP4SGX230HF35C3N?

The EP4SGX230HF35C3N combines large programmable logic capacity, significant on-chip RAM and a high I/O count in a compact FCBGA package, making it a practical choice for designs that demand integration of complex digital functions and extensive peripheral connectivity. Its defined core voltage range and commercial operating window simplify power and thermal planning for mainstream system designs.

Designed and supplied by Intel, this Stratix® IV GX FPGA targets applications where consolidating logic, memory and I/O into a single device reduces board-level complexity and component count while enabling dense, performance-oriented implementations.

Request a quote or submit an RFQ to receive pricing and availability information for the EP4SGX230HF35C3N.