EP4SGX230HF35C2

IC FPGA 564 I/O 1152FBGA
Part Description

Stratix® IV GX Field Programmable Gate Array (FPGA) IC 564 17544192 228000 1152-BBGA, FCBGA

Quantity 25 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1152-FBGA (35x35)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1152-BBGA, FCBGANumber of I/O564Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs9120Number of Logic Elements/Cells228000
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits17544192

Overview of EP4SGX230HF35C2 – Stratix® IV GX Field Programmable Gate Array (FPGA) IC, 228000 logic elements, 1152-BBGA

The EP4SGX230HF35C2 is an Intel Stratix IV GX Field Programmable Gate Array (FPGA) provided in a 1152-BBGA (35×35) surface-mount package. The device offers a high logic density architecture accompanied by on-chip memory and extensive I/O, and is documented in the Stratix IV Device Handbook device datasheet.

Design documentation for this device includes sections covering transceiver performance, DSP block specifications, TriMatrix memory blocks, PLLs and clock-tree specification, and configuration/JTAG behavior—making the device suitable for designs that require integrated transceivers, signal processing resources, and flexible clocking and configuration options.

Key Features

  • Core Logic  228,000 logic elements provide high integration density for complex FPGA implementations.
  • Embedded Memory  Approximately 17.5 Mbits of on-chip RAM (Total Ram Bits: 17,544,192) for data buffering, lookup tables and state storage.
  • I/O Resources  564 user I/Os to support broad peripheral connectivity and multiple high-pin-count interfaces.
  • Transceivers & DSP Blocks  Device documentation includes transceiver performance specifications and DSP block specifications for implementation of serial links and DSP-accelerated functions.
  • Clocking and Configuration  Stratix IV device handbook content covers PLL specifications, clock-tree details, and configuration/JTAG support for system timing and bring-up.
  • Power  Core supply range specified at 0.870 V to 0.930 V to match system power-rail planning for the FPGA core.
  • Package & Mounting  1152-FBGA (35×35) FCBGA package, surface-mount, intended for compact board-level integration.
  • Temperature & Grade  Commercial grade with an operating temperature range of 0 °C to 85 °C.
  • Compliance  RoHS compliant.

Typical Applications

  • High-speed communications  Leverages the device’s transceiver performance documentation and high I/O count for implementing serial links and protocol bridging.
  • DSP and signal processing  DSP block specifications and substantial on-chip memory support algorithm acceleration and streaming data processing.
  • Data acquisition and buffering  Large embedded memory and plentiful I/O make the device suitable for front-end data capture, buffering, and preprocessing tasks.
  • System integration and prototyping  High logic density and configurable clocking/PLL options assist in consolidating multiple system functions into a single FPGA device.

Unique Advantages

  • High logic density: 228,000 logic elements enable complex designs and feature consolidation on a single device.
  • Substantial on-chip memory: Approximately 17.5 Mbits of embedded RAM reduces external memory dependency for many buffering and stateful functions.
  • Extensive I/O availability: 564 user I/Os support a wide range of peripherals and parallel interfaces without extra IO expansion components.
  • Integrated transceiver and DSP documentation: Dedicated datasheet sections for transceivers and DSP blocks simplify evaluation and implementation of high-throughput and signal-processing features.
  • Compact FCBGA package: 1152-FBGA (35×35) package supports dense PCB layouts and surface-mount assembly.
  • Clear operating envelope: Commercial grade operation from 0 °C to 85 °C with specified core supply range (0.870–0.930 V) for predictable system integration.

Why Choose EP4SGX230HF35C2?

The EP4SGX230HF35C2 positions itself for designs that demand high logic capacity, significant on-chip memory, and extensive I/O in a compact FCBGA package. With detailed documentation covering transceiver performance, DSP block behavior, clocking/PLL, and configuration, the device supports complex FPGA implementations where integrated serial interfaces and signal-processing resources are required.

This Stratix IV GX device is appropriate for engineering teams consolidating multi-function systems or building throughput- and memory-heavy designs that benefit from tight integration and a defined operating specification. Device-level documentation in the Stratix IV Device Handbook provides the technical detail needed for migration from prototype to production designs.

Request a quote or submit a pricing request to discuss availability, lead times, and quantity pricing for EP4SGX230HF35C2.

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