EP4SGX290FF35I3

IC FPGA 564 I/O 1152FBGA
Part Description

Stratix® IV GX Field Programmable Gate Array (FPGA) IC 564 17661952 291200 1152-BBGA, FCBGA

Quantity 1,297 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1152-FBGA (35x35)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1152-BBGA, FCBGANumber of I/O564Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs11648Number of Logic Elements/Cells291200
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits17661952

Overview of EP4SGX290FF35I3 – Stratix IV GX FPGA, 291,200 logic elements, 1152‑BBGA

The EP4SGX290FF35I3 is a Stratix IV GX field‑programmable gate array (FPGA) IC built for high‑density logic and high‑bandwidth designs. The device combines a large logic fabric with embedded memory, advanced clocking and DSP capabilities, and high‑speed I/O/transceiver features described for the Stratix IV family.

Targeted at applications that require substantial on‑chip logic, extensive I/O and robust system integration, this industrial‑grade FPGA delivers a platform for complex signal processing, protocol bridging and high‑throughput data systems.

Key Features

  • Core logic — 291,200 logic elements (cells) for implementing large custom logic, control state machines and algorithmic datapaths.
  • Embedded memory — 17,661,952 bits of on‑chip RAM (approximately 17.66 Mbits) to support buffering, packet handling and local data storage.
  • I/O density — 564 user I/O pins to interface with external devices, memory and high‑speed peripherals.
  • High‑speed transceiver and I/O features — Includes the Stratix IV family’s high‑speed differential I/O and transceiver capabilities, supporting a wide range of protocol implementations and high aggregate data bandwidth as described in the device handbook.
  • DSP and clocking resources — On‑chip DSP blocks, PLLs and hierarchical clock networks support deterministic timing, multi‑rate designs and real‑time signal processing (features referenced in the Stratix IV device handbook).
  • Package and mounting — 1152‑BBGA (FCBGA), supplier package 1152‑FBGA 35×35; surface mount package for board‑level integration.
  • Power — Core supply specification between 870 mV and 930 mV for the device core voltage range.
  • Operating range and compliance — Industrial temperature grade with an operating temperature range of −40 °C to 100 °C and RoHS compliance.

Typical Applications

  • High‑performance communications — Implement protocol bridging, packet processing and high‑bandwidth interfaces using the device’s high‑speed transceiver features and large logic capacity.
  • Digital signal processing — Leverage on‑chip DSP blocks, abundant logic elements and embedded RAM for real‑time filtering, encoding/decoding and algorithm acceleration.
  • Network and infrastructure equipment — Use the dense I/O and clocking resources to build switch, router or subsystem functions requiring many external interfaces and precise timing.
  • High‑speed data acquisition — Pair the extensive I/O and on‑chip memory to capture, buffer and preprocess high‑rate sensor or test data streams.

Unique Advantages

  • Large programmable fabric: 291,200 logic elements enable complex system integration on a single FPGA, reducing external components and board complexity.
  • Significant embedded memory: Approximately 17.66 Mbits of on‑chip RAM supports buffering and local data manipulation without immediate external memory dependence.
  • High I/O count: 564 user I/O pins provide the pin density needed for multi‑interface designs and high connector counts.
  • Stratix IV GX family features: Access to high‑speed differential I/O, transceiver features, DSP blocks and advanced clocking described in the device handbook, enabling protocol flexibility and high aggregate bandwidth.
  • Industrial robustness: Industrial temperature range (−40 °C to 100 °C) and RoHS compliance support deployment in demanding environments.
  • Compact surface‑mount package: 1152‑BBGA (35×35) FCBGA package balances thermal and routing characteristics for dense PCB designs.

Why Choose EP4SGX290FF35I3?

The EP4SGX290FF35I3 delivers a combination of high logic density, substantial embedded memory and rich I/O/transceiver capability documented for the Stratix IV GX family. These attributes make it well suited for designs that require high aggregate data bandwidth, advanced signal processing and extensive system integration within an industrial temperature envelope.

For engineering teams developing communication subsystems, DSP‑centric products or complex interface controllers, this device offers the fabric and system resources to consolidate functions, streamline board design and maintain deterministic timing through integrated PLLs and clock networks.

Request a quote or submit a procurement inquiry to receive pricing and availability information for EP4SGX290FF35I3.

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